08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

VSITECH News

VSI launches the first automotive industry-standard high-speed SerDes silicon

VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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Provertha News

New PROVERTHA M12 angle adapters for X/D conversion save space in tight installation spaces

Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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ST News

STMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules

Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics simplifies sustainable product design with USB Type-C^® Power Delivery software for STM32 microcontrollers

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C^® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

KLA News

KLA Launches Revolutionary X-Ray Metrology System

New Axion^® T2000 Extends Advanced Metrology Portfolio That Addresses Vertical Scaling Challenges in Memory Chip Manufacturing.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

Qualcomm News

New Qualcomm Compact Macro 5G RAN platform optimizes mmWave investments

Introducing a powerful combination of small cell and macro cell innovation.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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ANSYS News

Ansys Announces GlobalFoundries Certification of Semiconductor Tools for GF 22FDX^® Platform

Foundry certification enables GF 22FDX customers to validate their chip designs’ power integrity and reliability with Ansys golden signoff tools.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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Infineon News

Infineon named CES 2023 “Innovation Awards Honoree” for three different products: EXCELON F-RAM, XENSIV CSK and Smart Alarm System

Infineon Technologies AG has been named a CES^® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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DENSO News

DENSO Receives IEEE Corporate Innovation Award for Developing and Spreading Use of QR Code

DENSO Corporation announced it has received the IEEE Corporate Innovation Award from IEEE, the largest international association for electrical and electronic engineering in the world, for developing the QR Code and spreading its use globally.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

Flex Power Modules News

Flex Power Modules’ BMR510 upgraded with improved efficiency

Flex Power Modules is announcing an upgrade to the specification of their innovative BMR510, a two-phase voltage regulator module. The BMR510 now utilizes advanced materials of magnetic core, yielding high inductance in a small package size, allowing lower switching frequency operation than would be necessary with the gapped ferrite cores previously used.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

VSI launches the first automotive industry-standard high-speed SerDes silicon

VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.

New PROVERTHA M12 angle adapters for X/D conversion save space in tight installation spaces

Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.

STMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules

Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.

STMicroelectronics simplifies sustainable product design with USB Type-C^® Power Delivery software for STM32 microcontrollers

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C^® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

KLA Launches Revolutionary X-Ray Metrology System

New Axion^® T2000 Extends Advanced Metrology Portfolio That Addresses Vertical Scaling Challenges in Memory Chip Manufacturing.

New Qualcomm Compact Macro 5G RAN platform optimizes mmWave investments

Introducing a powerful combination of small cell and macro cell innovation.

Ansys Announces GlobalFoundries Certification of Semiconductor Tools for GF 22FDX^® Platform

Foundry certification enables GF 22FDX customers to validate their chip designs’ power integrity and reliability with Ansys golden signoff tools.

Infineon named CES 2023 “Innovation Awards Honoree” for three different products: EXCELON F-RAM, XENSIV CSK and Smart Alarm System

Infineon Technologies AG has been named a CES^® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.

DENSO Receives IEEE Corporate Innovation Award for Developing and Spreading Use of QR Code

DENSO Corporation announced it has received the IEEE Corporate Innovation Award from IEEE, the largest international association for electrical and electronic engineering in the world, for developing the QR Code and spreading its use globally.

Flex Power Modules’ BMR510 upgraded with improved efficiency

International

Technical Articles

Case studies

White Paper

VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.

Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.

Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

New Axion® T2000 Extends Advanced Metrology Portfolio That Addresses Vertical Scaling Challenges in Memory Chip Manufacturing.

Introducing a powerful combination of small cell and macro cell innovation.

Foundry certification enables GF 22FDX customers to validate their chip designs’ power integrity and reliability with Ansys golden signoff tools.

Infineon Technologies AG has been named a CES® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.

DENSO Corporation announced it has received the IEEE Corporate Innovation Award from IEEE, the largest international association for electrical and electronic engineering in the world, for developing the QR Code and spreading its use globally.

International

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C^® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

New Axion^® T2000 Extends Advanced Metrology Portfolio That Addresses Vertical Scaling Challenges in Memory Chip Manufacturing.

Infineon Technologies AG has been named a CES^® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.