01
'22
Written on
Analog Devices News
01
'22
Written on
Intrinsic News
Intrinsic announces breakthrough as memory devices successfully demonstrated at commercially relevant nanometre scale
Intrinsic Semiconductor Technologies Ltd has successfully scaled its silicon oxide-based resistive random access memory devices to dimensions of 50 nanometres and demonstrated electrical performance characteristics that will enable their use as high-performance, low-cost, embedded,non-volatile memory in logic devices at advanced processing nodes.
01
'22
Written on
TDK News
Power Supplies: Open Frame & Din Rail Mount Buffer modules offer extended hold-up
TDK Corporation (TSE:6762) announces the new DBM20/ZBM20 and ZBM-AC of TDK-Lambda buffer modules. TDK-Lambda Corporation (President and CEO: Sanai Hattori) will start accepting orders from February 2022.
31
'22
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ANSYS News
Ansys Boosts Wistron Corporation’s 5G Cellphone Antenna Development
Ansys simulation solutions speed up analysis and time-to-market while reducing costs.
31
'22
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ZEISS News
ZEISS and Vision Engineering join forces with DeepFocus 1
The innovative and competitive inspection system brings extended depth of focus microscopy thanks to its MALS Technology to new market segments.
31
'22
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ViewSonic
ViewSonic Europe Introduces Ian Wedgewood as UK Strategic Relationship Manager and Ashley Holt as UK Sales Manager
ViewSonic Europe has welcomed Ian Wedgewood as Strategic Relationship Manager and Ashley Holt as Sales manager, focusing primarily on the education sector.
28
'22
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Toshiba News
TOSHIBA ANNOUNCES LOAD SWITCHES WITH ULTRA-LOW QUIESCENT CURRENT CONSUMPTION OF 0.08NA
Toshiba Electronics Europe GmbH (“Toshiba”) has launched three load switch products that deliver a remarkable decrease in quiescent current. The new devices are primarily intended for use in wearable and IoT applications where they will control the power supply for peripherals such as sensors.
28
'22
Written on
Segula Technologies News
SEGULA TECHNOLOGIES SIGNS AN INTEGRATION AGREEMENT WITH CIDEIN TO ACCELERATE ITS COMMITMENT TO ELECTRONIC ENGINEERING AND EMBEDDED TECHNOLOGY
SEGULA Technologies and CIDEIN have joined forces to undertake a consolidation and development plan both in Spain and worldwide. Both companies announce the development of a printed circuit board design centre of excellence in Barcelona, which will be supported by SEGULA's network of offices to offer better proximity to national and international customers. CIDEIN, Spain's leader in component technology, printed circuit board design and electronic boards, has more than 18,000 references for high value-added projects. With this agreement, SEGULA Technologies plans to double its activity in Spain.
28
'22
Written on
CEVA News
CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, announced today that it has expanded its IP market reach by introducing the Fortrix SecureD2D IP solution, enabling secure data exchange between different chiplets within a Heterogenous System on Chip (HSoC).
28
'22
Written on
Moxa
