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Infineon News

Infineon and Deeyook jointly enable precise location solution with low-power Wi-Fi chipset

The location-as-a-service (LaaS) company has invented and patented an award-winning tracking solution to determine indoor and outdoor locations of items, assets, and employees. Both companies fuse Deeyook’s ultra-precise, innovative algorithms into Infineon’s best-in-class, low power AIROC Wi-Fi® portfolio to enable an accurate, passive, ubiquitous, and efficient location solution.

CEVA News

CEVA Bluebud Platform Takes Center Stage for a Differentiated, Premium Wireless Audio Experience in TWS Earbuds, Gaming Headsets, Hearables, Wearables and More

Consumer Electronics Show -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, has announced that it has enhanced the software offerings and tool kits for its highly successful Bluebud wireless audio platform with the addition of Bluebud-HD, a pre-configured software package that includes all the audio, voice and context-aware software required in premium TWS earbuds, gaming headsets, hearables, wearables and other smart audio products.

NXP News

NXP Advances IoT Connectivity with Industry’s First Secure Tri-Radio Device

NXP® Semiconductors (NASDAQ: NXPI) today announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases, and supports the new groundbreaking Matter connectivity protocol.

Kontron News

KONTRON ANNOUNCES PRODUCTS FEATURING THE LATEST 12TH GEN INTEL® CORE PROCESSORS

Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), announces new boards and modules featuring the 12th Gen Intel® Core processors (Codename Alderlake-S series) for the Internet of Things. Kontron will update the current mini-ITX, µATX and ATX motherboards with this new processor series, and has also selected it as the 1st platform to adopt the new PICMG® COM-HPC®/Client form factor, as it serves best new technology trends set by COM-HPC® client specification.

NXP News

NXP Ramps Flagship 4D Imaging Radar Chip to Production, Adds New Product Tailored for Fast-Growing L2+ Market

NXP® Semiconductors (NASDAQ: NXPI) has announced two updates to its industry leading automotive radar portfolio, now designed-in at 20 top global OEMs. The industry’s first dedicated 16nm imaging radar processor, the NXP S32R45, has been released into mass production, with initial customer ramp-up starting in the first half 2022.

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