29
'22
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DTP
29
'22
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Tektronix News
Tektronix Showcases New and Innovative, Precise and Easy-to-Operate Technology Solutions at electronica 2022
Tektronix, Inc., a leading global equipment and software manufacturer delivering innovative, precise and easy-to-operate test, measurement and monitoring solutions, has today announced its participation at this year’s electronica 2022 exhibition, taking place in Munich from November 15-18.
29
'22
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Panasonic Industry News
Panasonic Industry launches new Bluetooth® Low Energy module with 512 kB flash for cost-effective applications that still require high performance
Panasonic Industry Europe has extended its range of Bluetooth® LE modules with the launch of the PAN1782, which targets cost-effective applications that still require high performance, including professional lighting, asset tracking, smart home, advanced wearables, and higher value IoT applications.
28
'22
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Keysight technologies News
Keysight, F5 and AMD Collaborate to Demonstrate 5G Terabit Scale Traffic at Mobile World Congress Las Vegas
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that the company’s CyPerf, a software-based cloud native traffic generator, will be used to demonstrate the performance capability of the F5 BIG-IP® Next Edge Firewall cloud-native network function (CNF), powered by the 3rd Gen AMD EPYC processors at AMD’s Booth W1.720, during Mobile World Congress Las Vegas to be held September 28-30, 2022.
28
'22
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MURATA News
Murata hosts series of attention-grabbing demos covering numerous application scenarios at its Electronica stand
Murata is now fully prepared to participate in this year’s Electronica (15th-18th November) - as the international electronic engineering community returns to Munich Messe once again, after a longer than expected absence.
28
'22
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TDK News
TDK offers clip-on NTC sensors for heat pumps in e-mobility
TDK Corporation presents the new B58101A0109A* (HP100) series of heat pump sensors for measuring the refrigerant temperature indirectly via the pipes' surface temperature.
28
'22
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Rutronik Info
State-of-the-art sensor fusion with the Rutronik Adapter Board RAB1
Rutronik System Solutions' board family gets a new addition with the RAB1 - Sensorfusion. The adapter board offers its own platform that allows machine learning (ML) based sensor fusion, which forms the basis and the future of artificial intelligence (AI). Equipped with the highest performance sensors from Infineon, Bosch SE, and Sensirion.
28
'22
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Renesas News
Renesas’ ClockMatrix System Synchronizer Delivers Class D Compliance for O-RAN S-Plane Requirements
ClockMatrix Device Provides Synchronization and Software Solution for the AMD RFSoC DFE Development Platform and O-RU Reference Design.
28
'22
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Siemens News
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi-die solution
Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
28
'22
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Diodes Incorporated News
