Congatec – a leading vendor of embedded and edge computing technology – extends its Intel Xeon D-2700 processor based Server-on-Module portfolio by launching five new modules in the compact (160x160mm) COM-HPC Server Size D performance class.
IFS Cloud Alliance harnesses the power of massive compute scalability to improve chip design efficiency and accelerate time-to-market for foundry customers.
STMicroelectronics has introduced its third-generation Bluetooth® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.
Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with Diotec Semiconductor, designers and manufacturers of discrete semiconductor components.
Comprehensive Suite of Tools Aids Government Regulators, Security Agencies, Spectrum Owners, and Defense Electronics Companies to Better Analyze RF Signals.
Toshiba Electronics Europe GmbH (“Toshiba”) today announces the availability of highly accurate G2 SPICE models allowing designers to more faithfully simulate the performance of their designs before committing to hardware.