CEVA, Inc, the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that its RivieraWaves ultra-wideband (UWB) IP has been extended with the RW-UWB-CCC MAC software package to support the Car Connectivity Consortium® (CCC) Digital Key 3.0 specification.
Accelleran, a leading provider of Open RAN software solutions for 4G/5G networks, has confirmed that it is part of the winning consortia that are about to undertake two major projects.
Congatec – a leading vendor of embedded and edge computing technology – introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each.
Performing X-ray absorption spectroscopy measurements is no longer reserved only for synchrotron beamlines. A lab-based solution developed at the BLiX lab (Technical University Berlin) has now been commercialized by HP Spectroscopy.
Alliance Electronics, a technological and industrial group specializing in electronic subcontracting, is setting up in France (Rosheim, Bas-Rhin) and finalizing its first three acquisitions.
Murata announces the MRD series of open-loop current sensors for industrial systems. Each integrates high-performance tunnel magneto-resistive (TMR) elements - enabling precision measurement with regard to both DC and AC currents up to 40A, as well as maintaining stable characteristics across an extensive temperature range.
Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, announced that it has been awarded 25 recognitions from its suppliers during the 2022 EDS Leadership Summit.
Ansys and TSMC extended their long-standing collaboration to achieve certification of Ansys’ power integrity software for TSMC’s industry-leading N4P and N3E process technologies. The certification for Ansys RedHawk-SC and Totem enables next generation silicon designs for machine learning, 5G mobile, and high-performance computing (HPC) applications. This latest collaboration builds on the recent certification of the Ansys platform for TSMC’s N4 and N3 processes.