The microspeakers for wireless in-ear headphones from Arioso Systems GmbH, a spin-off of the Fraunhofer Institute for Photonic Microsystems IPMS, are up to ten times smaller than conventional microspeakers and are made entirely from silicon. Currently at the prototype stage, the energy-efficient MEMS speakers may in future play a role in expanding the range of functions offered by miniaturized headphones – such as instant translations and health monitoring features. This is made possible by an innovative sound transducer principle that dispenses with the membrane, the central element of a conventional speaker.
Fanless with Rich IO, Designed for Industry 4.0. Avalue Technology Inc. (TAIEX: 3479-TW), a global industrial PC solution provider has launched its SLP-WHG: a new high performance Slot PC solution with EtherCAT. Manufacturers are constantly seeking improvements to production efficiency, and a new way to transform their business is through Industry 4.0.
Sivers Semiconductors AB today announces that the company’s future subsidiary MixComm* has signed a Memorandum of Understanding (MoU) with the South Korean venture company Kreemo to develop the world's first 5G module optimized for metaverse.
Beyond the buck regulator: Newest InnoSwitch3 IC family delivers simplicity, flexibility, and industry-leading efficiency in high-output-current designs.
System developers can capitalize on the non-proprietary, open-architecture embedded computing capabilities to deliver ruggedness in harsh operating environments and speed time-to-market while achieving cost-effectiveness.
Conrad Sourcing Platform puts a spotlight on education: using innovative testing equipment to teach technical skills at school, college and university.
ROHM has recently added a new thermal analysis function to its ROHM Solution Simulator. The new feature allows designers of electronic circuits and systems in the automotive and industrial markets to collectively verify power devices and driver ICs thermal issues on different solution circuits.