23
'22
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ONSEMI News
23
'22
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Siemens digital Industry Software News
Siemens collaborates with UMC to develop 3D integrated circuit hybrid bonding workflow
Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.
23
'22
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Panasonic Industry News
New 1500V PhotoMOS® relay in miniature DIP5 package from Panasonic targets industrial BMS
The new PhotoMOS® HE relay series from Panasonic Industry Europe offers 5kV I/O isolation and an increased clearance and creepage distance on output side, plus miniature 1-Form-A DIP5 packaging, making it particularly suitable as the switching solution for Battery Management Systems (BMS) in storage systems, charging stations, and numerous other high voltage measurement and infrastructure.
23
'22
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Digi-Key News
Digi-Key Electronics Announces 2022 Back2School Prize Draw
Digi-Key Electronics, which offers the world’s largest selection of electronic components and automation products in stock for immediate shipment, has opened its highly-anticipated annual Back2School Prize Draw sweepstakes, which gives college students an opportunity to win prizes that empower them to use real-world engineering tools and resources.
23
'22
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CK Switches News
C&K Adds Waterproof Version to Side-Actuated Tact Switch Family
C&K, now a part of Littelfuse Inc, and a leading manufacturer of high-quality electromechanical switches, has extended its PTS645V tactile switch series to include an IP67-rated version. The high-performance PTS645V waterproof switch can withstand harsh environmental conditions found in a wide-range of indoor and outdoor applications.
22
'22
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Fraunhofer News
Fraunhofer and Leibniz institutes kick off the "Green ICT @ FMD" competence center
In order to contribute to reducing the carbon footprint of digital technologies through research and development, the Fraunhofer and Leibniz institutes cooperating in the Forschungsfabrik Mikroelektronik Deutschland (Research Factory Microelectronics Germany) are jointly establishing a cross-site competence center for resource-conscious information and communications technology (Green ICT @ FMD).
22
'22
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Keysight technologies News
Keysight Technologies, Jiyun Technologies Collaborate to Deliver a Tailored, Compact Battery Test System
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced a collaboration with Jiyun Technologies to develop and deliver a tailored, compact battery test system for electric vehicles (EVs).
22
'22
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CEVA News
CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs
CEVA, Inc., the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, today introduced PentaG-RAN, the industry's first 5G baseband platform IP for ASICs targeting cellular infrastructure in both base station and radio configurations, including distributed units (DU), and Remote Radio Units (RRU), from small cell to Massive Multiple-Input, Multiple Output (mMIMO).
22
'22
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Sivers Semiconductors News
Sivers Semiconductors exhibits together with Richardson RFPD at European Microwave Week 2022
Sivers Semiconductors AB announces today that its subsidiary Sivers Wireless will exhibit at the European Microwave Exhibition, 27-29 September, during the European Microwave Week in Milan, Italy, together with its partner Richardson RFPD in booth #C28.
21
'22
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Microchip News
