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Fraunhofer News

MEMS MICROSPEAKERS FOR THE FUTURE OF THE MOBILE INTERNET

The microspeakers for wireless in-ear headphones from Arioso Systems GmbH, a spin-off of the Fraunhofer Institute for Photonic Microsystems IPMS, are up to ten times smaller than conventional microspeakers and are made entirely from silicon. Currently at the prototype stage, the energy-efficient MEMS speakers may in future play a role in expanding the range of functions offered by miniaturized headphones – such as instant translations and health monitoring features. This is made possible by an innovative sound transducer principle that dispenses with the membrane, the central element of a conventional speaker.

Avalue News

Avalue Announces SLP-WHG: High Performance Slot PC Solution with EtherCAT

Fanless with Rich IO, Designed for Industry 4.0. Avalue Technology Inc. (TAIEX: 3479-TW), a global industrial PC solution provider has launched its SLP-WHG: a new high performance Slot PC solution with EtherCAT. Manufacturers are constantly seeking improvements to production efficiency, and a new way to transform their business is through Industry 4.0.

Adlinktech News

ADLINK and Pixus Technologies Build a Strategic Partnership to Develop Highly Integrated, SOSA-Aligned OpenVPX System Solutions for Aerospace and Defense Applications

System developers can capitalize on the non-proprietary, open-architecture embedded computing capabilities to deliver ruggedness in harsh operating environments and speed time-to-market while achieving cost-effectiveness.

Intel News

Introducing Intel’s Long-Term Retention Lab

At Intel’s Long-Term Retention Lab, researchers work with generations of products to provide security and functional updates for customers.

Conrad News

Electrical Testing: Practice Makes Perfect

Conrad Sourcing Platform puts a spotlight on education: using innovative testing equipment to teach technical skills at school, college and university.

Rohm Semiconductors News

UPDATE ON ROHM SOLUTION SIMULATOR: NEW THERMAL ANALYSIS FUNCTION

ROHM has recently added a new thermal analysis function to its ROHM Solution Simulator. The new feature allows designers of electronic circuits and systems in the automotive and industrial markets to collectively verify power devices and driver ICs thermal issues on different solution circuits.

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