18 {{ "2021-12-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-18T00:00:00+00:00" | date "longDate" }}

Fischer Elektronik News

5 SMD …)

The steadily increasing trend towards packaging forms suitable for automatic machines is unbroken. As a result the inquiries and orders for machine-compatible packaging for connectors in "tape & reel" packaging have increased significantly in recent months.

Read more…

17 {{ "2021-12-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-17T00:00:00+00:00" | date "longDate" }}

ViewSonic

ViewSonic vTouch Brings Full macOS Monterey Multi-Touch Compatibility to TD Series Monitors

ViewSonic Corp., a leading global provider of visual solutions, launched the vTouch 3.1 driver for its TD Series touchscreen monitors, making the displays compatible with the newly released macOS Monterey

Read more…

17 {{ "2021-12-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-17T00:00:00+00:00" | date "longDate" }}

Septentrio News

Should you build your own GNSS/INS?

5 Reasons why a pre-integrated GNSS/INS solution brings more value.

Read more…

17 {{ "2021-12-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-17T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Launches Automotive Actuator and Sensor Control MCUs for Evolving Edge Applications in Next-Generation E/E Architecture

16-Bit RL78/F24 and RL78/F23 Deliver Enhanced Security, Connectivity, and Functional Safety Capabilities.

Read more…

17 {{ "2021-12-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-17T00:00:00+00:00" | date "longDate" }}

IAR Systems News

Secure Thingz and Intrinsic ID partner to ensure supply chains of trust for the embedded industry

Partnership to enable rapid development, implementation, and provisioning of unique and secure identity for IoT applications.

Read more…

17 {{ "2021-12-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-17T00:00:00+00:00" | date "longDate" }}

Recabuk News

11th Gen processors bolster embedded vision systems

New COMs based on latest Intel Core processors bring benefits to demanding IoT, edge and vision applications.

Read more…

17 {{ "2021-12-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-17T00:00:00+00:00" | date "longDate" }}

CEA Leti News

HfO2-Based FeRAM Arrays Designed & Fabricated at CEA-Leti Bring the Technology Closer to Manufacturability

Unlike PZT-Based Ferroelectric Memories, These Devices Are Fully Compatible With CMOS Processes, Scalable to Advanced Nodes and Lead-Free.

Read more…

17 {{ "2021-12-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-17T00:00:00+00:00" | date "longDate" }}

Infineon News

Improved power density: alpitronic selects Infineon's EasyPACK CoolSiC modules and EiceDRIVER X3 drivers for its 50 kW hypercharger

Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic recently introduced the state-of-the-art and industry-leading 50 kW DC electric vehicle charger HYC50.

Read more…

17 {{ "2021-12-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-17T00:00:00+00:00" | date "longDate" }}

Rutronik News

Maximum reliability even under heavy workloads: ATP DDR4 and DDR3 DRAM modules at Rutronik

Long-term stability and high performance in industrial environments: in the current generation of ATP DRAM modules, the DDR4, the data transfer rate of up to 3200 MT/s ensures an increase in the possible maximum clock speed. The supply voltage here is just 1.2 V.

Read more…

17 {{ "2021-12-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-17T00:00:00+00:00" | date "longDate" }}

ARROW News

Arrow Electronics introduces flexible data acquisition platform based on Analog Devices signal chain technologies and Intel^® FPGA

DataStorm DAQ platform eases timing and data integrity design challenges. Arrow Electronics has announced the DataStorm DAQ, a reference, evaluation and development platform that connects Analog Devices’ (ADI) sensor and analogue-to-digital signal chain technologies to an FPGA with integrated CPU.

Read more…

Technical Articles

ROHM Develops a New Op Amp that Minimizes Current Consumption

EXTENSION OF THE PACKAGING OPTIONS FOR MALE HEADERS WITH A GRID PATTERN OF 1.27 MM (SLV W 3 / 4 / 5 SMD …)

The steadily increasing trend towards packaging forms suitable for automatic machines is unbroken. As a result the inquiries and orders for machine-compatible packaging for connectors in "tape & reel" packaging have increased significantly in recent months.

ViewSonic vTouch Brings Full macOS Monterey Multi-Touch Compatibility to TD Series Monitors

ViewSonic Corp., a leading global provider of visual solutions, launched the vTouch 3.1 driver for its TD Series touchscreen monitors, making the displays compatible with the newly released macOS Monterey

Should you build your own GNSS/INS?

5 Reasons why a pre-integrated GNSS/INS solution brings more value.

Renesas Launches Automotive Actuator and Sensor Control MCUs for Evolving Edge Applications in Next-Generation E/E Architecture

16-Bit RL78/F24 and RL78/F23 Deliver Enhanced Security, Connectivity, and Functional Safety Capabilities.

Secure Thingz and Intrinsic ID partner to ensure supply chains of trust for the embedded industry

Partnership to enable rapid development, implementation, and provisioning of unique and secure identity for IoT applications.

11th Gen processors bolster embedded vision systems

New COMs based on latest Intel Core processors bring benefits to demanding IoT, edge and vision applications.

HfO2-Based FeRAM Arrays Designed & Fabricated at CEA-Leti Bring the Technology Closer to Manufacturability

Unlike PZT-Based Ferroelectric Memories, These Devices Are Fully Compatible With CMOS Processes, Scalable to Advanced Nodes and Lead-Free.

Improved power density: alpitronic selects Infineon's EasyPACK CoolSiC modules and EiceDRIVER X3 drivers for its 50 kW hypercharger

Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic recently introduced the state-of-the-art and industry-leading 50 kW DC electric vehicle charger HYC50.

Maximum reliability even under heavy workloads: ATP DDR4 and DDR3 DRAM modules at Rutronik

Long-term stability and high performance in industrial environments: in the current generation of ATP DRAM modules, the DDR4, the data transfer rate of up to 3200 MT/s ensures an increase in the possible maximum clock speed. The supply voltage here is just 1.2 V.

Arrow Electronics introduces flexible data acquisition platform based on Analog Devices signal chain technologies and Intel^® FPGA

DataStorm DAQ platform eases timing and data integrity design challenges. Arrow Electronics has announced the DataStorm DAQ, a reference, evaluation and development platform that connects Analog Devices’ (ADI) sensor and analogue-to-digital signal chain technologies to an FPGA with integrated CPU.

International