19 {{ "2022-10-19T00:00:00+00:00" | date "MMM" }} '22

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ICsense News

ASIC supplier ICsense ramps-up next generation chemical sensor interface device to full-scale production

ICsense, a TDK Group Company and independent subsidiary that focuses on the supply of application-specific integrated circuits (ASICs) and custom chip design services, has started mass production of a new chemical sensor interface ASIC.

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19 {{ "2022-10-19T00:00:00+00:00" | date "MMM" }} '22

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Sivers Semiconductors News

Sivers Semiconductors and Chalmers University of Technology granted 4 MSEK to collaborate in research and development of new generation power amplifiers

Sivers Semiconductors AB (publ) (“Sivers”) today announces that its business unit, Sivers Wireless, and the Department of Microtechnology and Nanoscience at Chalmers University of Technology (“Chalmers”) will collaborate in research and development of a new generation of power amplifiers.

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18 {{ "2022-10-18T00:00:00+00:00" | date "MMM" }} '22

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Infineon News

Supermicro collaborates with Infineon on green computing, leverages Infineon’s high-efficiency power stages to reduce data center power usage

The new dimension of digitalization is enormous and global data volumes will only multiply exponentially in the future with video streaming, virtual conferences, cloud services, cryptocurrencies and many other digital applications.

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18 {{ "2022-10-18T00:00:00+00:00" | date "MMM" }} '22

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Keysight technologies News

Keysight Introduces Automated and AI-Driven Testing to Optimize Experiences on 5G Smartphones

New application test automation method accelerates assessment of the quality of experience delivered by the world’s most widely used mobile applications.

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18 {{ "2022-10-18T00:00:00+00:00" | date "MMM" }} '22

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NEC Corporation News

NEC to build 5G Innovation lab for the NSW Telco Authority

NEC Corporation has been selected by the New South Wales (NSW) Telco Authority to build the initial phase of a state-of-the-art 5G innovation lab as part of a new strategic partnership.

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17 {{ "2022-10-17T00:00:00+00:00" | date "MMM" }} '22

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DFI

DFI and AEWIN Partner to Empower Software Virtualization Technology Through AMD Platform Ultra-small Products

DFI, the world’s leading brand in embedded motherboards and industrial computers, was invited to participate in “AMD Datacenter Solutions Day” in September.

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14 {{ "2022-10-14T00:00:00+00:00" | date "MMM" }} '22

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Flex Power Modules News

Flex Power Modules teams up with onsemi to develop ultra-small Intermediate Bus Converter

Flex Power Modules is announcing the launch of their BMR313 Intermediate Bus Converter (IBC) at the 2022 Open Compute Project global summit in October in San Jose CA 18th of October.

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14 {{ "2022-10-14T00:00:00+00:00" | date "MMM" }} '22

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Rutronik Info

Faster handling: The new, ultra-flat SMD thread inserts from Keystone at Rutronik

Keystone Electronics expands its product portfolio of ultra-flat surface mount thread inserts with the launch of metric and inch threaded versions. The surface mount inserts are now available in metric thread (M2.5, M3, M4) or inch thread (2-56, 4-40, 6-32). With a protrusion of just 0.3 millimeters above the board, particularly flat integration is possible.

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14 {{ "2022-10-14T00:00:00+00:00" | date "MMM" }} '22

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TDK News

Exhibitions: TDK showcases smart glasses equipped with ultra-compact full color laser module at major exhibitions

TDK Corporation will display first-of-its-kind smart glasses equipped with the world's smallest class* ultra-compact full-color laser module (FCLM) under development by TDK during CEATEC 2022, which starts on October 18, 2022.

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14 {{ "2022-10-14T00:00:00+00:00" | date "MMM" }} '22

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Keysight technologies News

Keysight Enables Microamp Solutions to Accelerate Development of mmWave Radio Units for Private 5G Networks

Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that Microamp Solutions has selected Keysight Open Radio Architect (KORA) solutions to meet increasing demand for mmWave radio units in private 5G networks.

Read more…

ICsense, a TDK Group Company and independent subsidiary that focuses on the supply of application-specific integrated circuits (ASICs) and custom chip design services, has started mass production of a new chemical sensor interface ASIC.

Sivers Semiconductors AB (publ) (“Sivers”) today announces that its business unit, Sivers Wireless, and the Department of Microtechnology and Nanoscience at Chalmers University of Technology (“Chalmers”) will collaborate in research and development of a new generation of power amplifiers.

The new dimension of digitalization is enormous and global data volumes will only multiply exponentially in the future with video streaming, virtual conferences, cloud services, cryptocurrencies and many other digital applications.

New application test automation method accelerates assessment of the quality of experience delivered by the world’s most widely used mobile applications.

NEC Corporation has been selected by the New South Wales (NSW) Telco Authority to build the initial phase of a state-of-the-art 5G innovation lab as part of a new strategic partnership.

DFI, the world’s leading brand in embedded motherboards and industrial computers, was invited to participate in “AMD Datacenter Solutions Day” in September.

Flex Power Modules is announcing the launch of their BMR313 Intermediate Bus Converter (IBC) at the 2022 Open Compute Project global summit in October in San Jose CA 18th of October.

TDK Corporation will display first-of-its-kind smart glasses equipped with the world's smallest class* ultra-compact full-color laser module (FCLM) under development by TDK during CEATEC 2022, which starts on October 18, 2022.

International