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Beckhoff News

Real-time-capable data communication via OPC UA from Beckhoff

Direct integration of OPC UA Pub/Sub communication into the TwinCAT 3 runtime paves the way for straightforward realisation of machine-to-machine (M2M) and device-to-cloud (D2C) scenarios based on the OPC UA Pub/Sub specification.

Melexis News

Pre-drivers MLX81340 and MLX81344 enable 500W LIN-based mechatronic module miniaturization

Melexis revealed new LIN BLDC-motor pre-drivers that combine small size with high performance and power capability for automotive mechatronic applications. The MLX81340 (32KB Flash) and MLX81344 (64KB Flash) integrate three channels of high-side and low-side drivers. They control external NFETs with up to 60nC capacitance to handle applications up to 500W.

CEA Leti News

CEA-Leti Research Team Proposes New Approach for Next-Generation Memories with RRAM Energy-Storage Breakthrough

In a breakthrough that is expected to significantly advance in-memory energy-storage in resistive-RAM (RRAM) devices, CEA-Leti has proposed a “newfangled approach” that allows these devices to operate as energy-storage elements as well as memory, depending on the applied bias.

Telit News

Telit’s LTE Cat 1 LE910S1-ELG with Embedded GNSS Receiver Enables High-Performance IoT Applications in Latin America

New all-in-one cellular LTE and GNSS module provides superior throughput, latency, mobility and voice support. Product covers all LATAM 4G and 2G Bands plus mainstream bands used in Europe and Asia, making it an ideal module for intercontinental deployments.

NEC Corporation News

DOCOMO and NEC successfully test 5G Standalone with base station

NTT DOCOMO, INC. (DOCOMO) and NEC Corporation (NEC) have succeeded in interoperability testing for 5G standalone (SA) using a 5G base station baseband unit (5G CU/DU) conforming to O-RAN open interface specifications and radio units (RUs) of different vendors.

MURATA News

Power inductors for 5G which offer improvements in Isat and RDC specifications

Murata announces availability of the DFE21CCN_EL series of power inductors for 5G smartphones. Intended for use in DC/DC converters and power management circuitry, these components signify major enhancements in operational performance parameters when compared to the company’s conventional inductors.

Kontron News

KONTRON’S ACE FLIGHT 4783 DUAL MODEM MODMAN IS NOW FLIGHT-QUALIFIED

Kontron, a leading global provider of embedded computing Inflight Entertainment and Connectivity (IFE&C) solutions, today announces the first flight and qualification of the ACE Flight 4783 Dual Modem MODMAN.

Toshiba News

Toshiba Releases High Peak Output Current Photocouplers in Thin Packages for Driving IGBTs/MOSFETs Gates

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has introduced two photocouplers, “TLP5705H” and “TLP5702H,” housed in a thin SO6L package, for use as insulated gate drivers for small to medium capacity IGBTs/MOSFETs. Volume shipments start today.

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