09
'22
Written on
TDK News
09
'22
Written on
Infineon News
“Building new Connections:” Infineon links digital to the real world with new decarbonization and IoT solutions at EW Nuremberg 2022
Infineon Technologies AG today announced plans to highlight how it links the real to the digital world by enabling smart and connected applications at Embedded World 2022 in Nuremberg. A prerequisite for unlocking the potential of the IoT and decarbonization. The company will showcase a variety of smart IoT applications in sectors including smart building and homes, smart factories and smart mobility, along with its latest software and tools for system builders and makers working across the electronics industry.
09
'22
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CEVA News
CEVA Bluetooth® 5.3 Platform IP Supports New Auracast Broadcast Audio, Transforming the Shared Audio Experience
Auracast broadcast audio unveiled by Bluetooth SIG enables single audio source Auracast transmitter device to broadcast one or more audio streams to multiple Auracast receiver devices.
09
'22
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ANSYS News
Ansys Significantly Increases Speed and Capacity of Semiconductor Signoff with Massively Scalable SeaScape Platform
New products Ansys® Totem-SC and Ansys® PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors.
09
'22
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ST News
STMicroelectronics’ newest NFC readers accelerate payment and consumer application designs
STMicroelectronics’ ST25R3916B-AQWT and ST25R3917B-AQWT NFC Forum Reader devices combine high output power and energy efficiency at a competitive price.
08
'22
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ST News
STMicroelectronics’ flexible high-voltage op amp targets automotive and industrial environments
The STMicroelectronics TSB622 general-purpose low-power dual operational amplifier (op amp) enhances ruggedness and flexibility in industrial and automotive applications.
08
'22
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Qualcomm News
Qualcomm Deepens Relationship with PATEO to Create Next-Generation Qinggan Intelligent Cockpit Platform Solution
Qualcomm Technologies, Inc. today announced the company’s relationship with PATEO CONNECT+ (hereinafter referred to as “PATEO”) in the automotive intelligent cockpit field.
08
'22
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Intel News
Intel Demonstrates Commitment to Security at RSA Conference 2022
Intel’s latest security innovations – cutting-edge product capabilities, demos and real-world use cases – were in the spotlight throughout RSA Conference. At RSA Conference this week in San Francisco, Intel reinforced its commitment to security. At the event, leaders from Intel and its ecosystem partners came together to discuss how the company is addressing some of the toughest security challenges, including hybrid workforces and an increase in connected devices.
08
'22
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Toshiba News
Toshiba Adds Five New MOSFET Gate Driver ICs that Will Help Reduce Device Footprints
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added five products to its lineup of MOSFET gate driver ICs in the TCK42xG Series for mobile devices such as wearables. The new products in the series are equipped with an overvoltage lockout function and control the gate voltage of an external MOSFET according to the input voltage.
08
'22
Written on
TTI News
