16 {{ "2021-12-16T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-16T00:00:00+00:00" | date "longDate" }}

Inelta News

Replaceable at full process pressure: New LVDT valve sensors with a modular design

With their special modular construction, the LVDT-based valve sensors in the IHDL-M16 series from Inelta Sensorsysteme allow the sensor module to be replaced while the process is running.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Acceed News

Slim industry switch with 8 RJ45 + 2 SFP

A switch must always be affordable and easy to install if high port density is required in extended industrial centres. Robust design for the highest possible permissible ambient temperatures during operation is a further factor in favour of enabling rail mounting and the installation of several switches in switch boxes.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Moxa

Moxa Demonstrates Game-changing Solution for Next-level Time-sensitive Networking

Joint Collaboration Between Moxa, Intel, and port industrial automation GmbH to Advance Deterministic Network Communication Over Standard Ethernet.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

innodisk

Innodisk Releases the World’s First 10GbE LAN Module in M.2 Form Factor

Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Develops Write Technologies for Embedded STT-MRAM Significantly Reducing MCUs Power Consumption in IoT Applications

Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Omniflex News

All-in-one solutions help deliver ongoing operational efficiency

Why industry should look to fully integrated all-in-one monitoring and control systems.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

iSYSTEM News

Risk-free debugging with iSYSTEM Galvanic Isolation Adapters

Preventing personal injury and electrical damage to both development equipment and target.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon expands wireless portfolio to support Matter with multiprotocol solutions including Bluetooth LE and 802.15.4 low-power SoC for smart homes

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC Bluetooth^® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces Second-Generation of ClockMatrix Family of Network Synchronizers and Jitter Attenuators for Optical and Wireline Networks

New ClockMatrix 2 Delivers Industry’s First Single Chip Network Synchronizer and Jitter Attenuator with Ultra-Low Jitter Clock Outputs While Supporting all IEEE1588 operating modes.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Binder News

SUBMINIATURE CONNECTORS MEET HIGHEST DEMANDS ON PROTECTION AND FLEXIBILITY

The compact and highly flexible circular connectors of binder's 670 series withstand demanding protection requirements. Rated as particularly innovative among more than 100 products, they have now received a prestigious award.

Read more…

With their special modular construction, the LVDT-based valve sensors in the IHDL-M16 series from Inelta Sensorsysteme allow the sensor module to be replaced while the process is running.

Joint Collaboration Between Moxa, Intel, and port industrial automation GmbH to Advance Deterministic Network Communication Over Standard Ethernet.

Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility

Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip.

Why industry should look to fully integrated all-in-one monitoring and control systems.

Preventing personal injury and electrical damage to both development equipment and target.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC Bluetooth® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market.

New ClockMatrix 2 Delivers Industry’s First Single Chip Network Synchronizer and Jitter Attenuator with Ultra-Low Jitter Clock Outputs While Supporting all IEEE1588 operating modes.

The compact and highly flexible circular connectors of binder's 670 series withstand demanding protection requirements. Rated as particularly innovative among more than 100 products, they have now received a prestigious award.

International

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC Bluetooth^® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market.