Two product releases from Softing's smartLink family offer enhanced functionalities for Plant Asset Management and the implementation of Industry 4.0 connectivity in industrial networks.
Toshiba Electronics Europe GmbH has launched a ±2.5A output smart gate driver photocoupler able to control IGBTs and MOSFETs, reliably protecting power devices from over-current. The device is suited to a wide range of applications including inverters, AC servo drives, photovoltaic inverters and uninterruptible power supplies.
On occasion of the consumer electronics show IFA 2022 in Berlin, Germany, Infineon Technologies AG presents the most important trends for the future of payments: digital wallets and payments through connected devices in the Internet of Things, as well as biometrics.
With the X8G 150 °C extension, KEMET complements its high- temperature dielectric Class I portfolio. The capacitor is a robust and reliable component for critical applications that require stability at higher operating temperatures.
Advantest Corp. with headquarters in Chiyoda-ku, Tokyo, Japan, has selected the R&S RTP high-performance oscilloscope for mass production evaluation of high speed SoC testers. The R&S RTP is part of Advantest's continuous efforts to improve quality and was a key factor in updating the company’s verification environment to meet latest requirements. The decision for Rohde & Schwarz indicates that the long-term relationship between Advantest and Rohde & Schwarz will continue.
Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that the XPLR-IoT-1 explorer kit from u-blox, a global technology leader in positioning and wireless communication, is now available for purchase globally, exclusively from Digi-Key.
TDK Corporation presents the compact, rugged B58620F3800B768 AFA pressure transmitter for screw mounting for a wide range of industrial applications. It is designed for a pressure range of 1 bar to 11 bar and temperatures from -20 °C to +125 °C.
The STEVAL-ASTRA1B multi-connectivity evaluation platform from STMicroelectronics provides a complete ecosystem for building complete proof-of-concept for asset tracking systems.