Helping to improve the reliability and safety of semiconductor devices in the IoT and automotive fields. Hitachi High-Tech Corporation has announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI2800, a critical component in any semiconductor manufacturer's metrology capabilities.
The iVativ RENO module is based on the Nordic nRF52840 SoC and supports Bluetooth 5.0, Thread/ZigBee/ANT and NFC-A is now available at Rutronik. It is suitable for smart home applications, asset trackers and location devices, smart fitness devices, healthcare systems, IIoT sensors and control, and mobile payments.
Expanding on its history of delivering highly integrated processors, Texas Instruments (TI) today introduced new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a new distribution agreement with Innodisk, a premier provider of industrial embedded flash and DRAM storage products and technologies, with a focus on the enterprise, industrial, medical, and aerospace industries.
Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time savings feed-through for cables with and without plugs.
For a long time, hazardous areas remained untouched by digitalization because any mobile devices used must meet the strict requirements of explosion protection due to the risks in such areas. With intrinsically safe smart devices, the Pepperl+Fuchs brand ecom instruments is bringing digital transformation to hazardous areas.
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, proudly announces that it has received the 2021 Global High-Service Distributor of the Year award from Littelfuse, an industrial technology manufacturing company empowering a sustainable, connected, and safer world.
Today, we have more choice than ever when it comes to machine vision camera sensors and models. Beyond, megapixels and speed, a good place start narrowing down camera choices is with EMVA 1288 information. These specifications allow the comparison of the image quality of cameras and sensors such as read noise or how well they might perform in low light conditions.
The new chips enable I3C control plane networks with multiple initiator controllers, such as CPU and Baseboard Management Controllers (BMC), to support targets across a large physical network running at full speed by improving signal integrity and reducing capacitive loading. They also support heterogeneous designs by providing IO level shifting and protocol translation for mixed I2C/SMBus and I3C networks.
This year, Intel has committed to achieve net-zero greenhouse gas emissions in our global operations by 2040 and to develop more sustainable technology solutions. Keeping up with the insatiable demands for computing while creating a sustainable future is one of the biggest challenges for high performance computing (HPC). While daunting, it is achievable if we address every part of the HPC compute stack – silicon, software, and systems.