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Hitachi News

Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI2800, Achieving High-Sensitivity 100% Inspection for Semiconductor Devices in the IoT and Automotive Fields

Helping to improve the reliability and safety of semiconductor devices in the IoT and automotive fields. Hitachi High-Tech Corporation has announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI2800, a critical component in any semiconductor manufacturer's metrology capabilities.

Rutronik Info

Design flexibility for smart applications

The iVativ RENO module is based on the Nordic nRF52840 SoC and supports Bluetooth 5.0, Thread/ZigBee/ANT and NFC-A is now available at Rutronik. It is suitable for smart home applications, asset trackers and location devices, smart fitness devices, healthcare systems, IIoT sensors and control, and mobile payments.

Texas Instruments News

New processors make edge AI more accessible while cutting power consumption in half

Expanding on its history of delivering highly integrated processors, Texas Instruments (TI) today introduced new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.

Mouser News

MOUSER ELECTRONICS INKS GLOBAL DISTRIBUTION AGREEMENT WITH INNODISK TO DELIVER INDUSTRIAL STORAGE PRODUCTS

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a new distribution agreement with Innodisk, a premier provider of industrial embedded flash and DRAM storage products and technologies, with a focus on the enterprise, industrial, medical, and aerospace industries.

CONTA-CLIP News

KDSI-SR modular cable entry installed from the outside

Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time savings feed-through for cables with and without plugs.

PEPPERL+FUCHS PROCESS AUTOMATION

ecom instruments at the Hannover Messe 2022: Smart Devices for the Digitalization of Hazardous Areas

For a long time, hazardous areas remained untouched by digitalization because any mobile devices used must meet the strict requirements of explosion protection due to the risks in such areas. With intrinsically safe smart devices, the Pepperl+Fuchs brand ecom instruments is bringing digital transformation to hazardous areas.

Mouser News

Mouser Electronics Recognised As Global Distributor of the Year by Littelfuse for Fifth Consecutive Year

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, proudly announces that it has received the 2021 Global High-Service Distributor of the Year award from Littelfuse, an industrial technology manufacturing company empowering a sustainable, connected, and safer world.

Teledyne Flir Machine Vision

The Teledyne FLIR 2022 Mono and Color Sensor Reviews are now available!

Today, we have more choice than ever when it comes to machine vision camera sensors and models. Beyond, megapixels and speed, a good place start narrowing down camera choices is with EMVA 1288 information. These specifications allow the comparison of the image quality of cameras and sensors such as read noise or how well they might perform in low light conditions.

Renesas News

Renesas Unveils Industry’s First I3C Intelligent Switch Family for Next Generation Server, Storage and Communications Systems

The new chips enable I3C control plane networks with multiple initiator controllers, such as CPU and Baseboard Management Controllers (BMC), to support targets across a large physical network running at full speed by improving signal integrity and reducing capacitive loading. They also support heterogeneous designs by providing IO level shifting and protocol translation for mixed I2C/SMBus and I3C networks.

Intel News

Accelerated Innovations for Sustainable, Open HPC

This year, Intel has committed to achieve net-zero greenhouse gas emissions in our global operations by 2040 and to develop more sustainable technology solutions. Keeping up with the insatiable demands for computing while creating a sustainable future is one of the biggest challenges for high performance computing (HPC). While daunting, it is achievable if we address every part of the HPC compute stack – silicon, software, and systems.

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