09 {{ "2022-12-09T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-09T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM Industry’s Highest Rated Power Shunt Resistors in the 0508 Size: Contributing to Greater Miniaturization

Lineup also expanded to include two updated general-purpose MCR series shunt resistors.

Read more…

09 {{ "2022-12-09T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-09T00:00:00+00:00" | date "longDate" }}

Rutronik Info

More flexibility for high-end applications: The new XMC7000 microcontrollers from Infineon at Rutronik

Infineon is adding the XMC7000 series to its microcontroller portfolio. The new MCU family includes a single- or a dual-core Arm^® Cortex^®-M7 core, both with Arm^® Cortex^®-M0+ support.

Read more…

09 {{ "2022-12-09T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-09T00:00:00+00:00" | date "longDate" }}

MURATA News

Compact, High Current Rated Chip Ferrite Beads Meet the Need for Greater Noise Suppression in Automotive Systems

Murata has broadened its portfolio of chip ferrite beads with the introduction of the BLM15PX_SH1 and BLM15PX_BH1 series. Supplied in a 1005 mm (0402 inch) size, these compact and rugged units are highly optimised for automobile deployment.

Read more…

09 {{ "2022-12-09T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-09T00:00:00+00:00" | date "longDate" }}

CEA Leti News

CEA-Leti Quantum Program Director, Maud Vinet, Shares the Path Towards Full Fault-Tolerant Quantum Computing with Si-Based VLSI Technologies In Plenary Talk at IEDM 2022

CEA-Leti presented three papers at IEDM 2022 detailing its recent advances and future challenges in quantum computing using Si-based qubit devices with FDSOI technologies. A plenary talk presented the path towards scalable quantum computers with silicon technology.

Read more…

09 {{ "2022-12-09T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-09T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Joins Intel Foundry Services Accelerator EDA Alliance Program

Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world , announced that it has joined the Intel Foundry Services (IFS) Accelerator Electronic Design Automation (EDA) Alliance program.

Read more…

09 {{ "2022-12-09T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-09T00:00:00+00:00" | date "longDate" }}

U Blox News

u-blox announces the smallest Bluetooth Angle-of-Arrival (AoA) antenna board for commercial tracking solutions

The ANT-B11 compact antenna board offers accurate direction finding and indoor positioning supported by u-blox latest technology.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

VSITECH News

VSI launches the first automotive industry-standard high-speed SerDes silicon

VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

Provertha News

New PROVERTHA M12 angle adapters for X/D conversion save space in tight installation spaces

Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules

Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics simplifies sustainable product design with USB Type-C^® Power Delivery software for STM32 microcontrollers

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C^® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

High-Speed Vision Solution for IC Chip Marking Inspection and Recognition

Case studies

NEXCOM, Profet AI Empower Engineers with Accessible Industrial AI

ROHM Industry’s Highest Rated Power Shunt Resistors in the 0508 Size: Contributing to Greater Miniaturization

Lineup also expanded to include two updated general-purpose MCR series shunt resistors.

More flexibility for high-end applications: The new XMC7000 microcontrollers from Infineon at Rutronik

Infineon is adding the XMC7000 series to its microcontroller portfolio. The new MCU family includes a single- or a dual-core Arm^® Cortex^®-M7 core, both with Arm^® Cortex^®-M0+ support.

Compact, High Current Rated Chip Ferrite Beads Meet the Need for Greater Noise Suppression in Automotive Systems

Murata has broadened its portfolio of chip ferrite beads with the introduction of the BLM15PX_SH1 and BLM15PX_BH1 series. Supplied in a 1005 mm (0402 inch) size, these compact and rugged units are highly optimised for automobile deployment.

CEA-Leti Quantum Program Director, Maud Vinet, Shares the Path Towards Full Fault-Tolerant Quantum Computing with Si-Based VLSI Technologies In Plenary Talk at IEDM 2022

CEA-Leti presented three papers at IEDM 2022 detailing its recent advances and future challenges in quantum computing using Si-based qubit devices with FDSOI technologies. A plenary talk presented the path towards scalable quantum computers with silicon technology.

Keysight Joins Intel Foundry Services Accelerator EDA Alliance Program

u-blox announces the smallest Bluetooth Angle-of-Arrival (AoA) antenna board for commercial tracking solutions

The ANT-B11 compact antenna board offers accurate direction finding and indoor positioning supported by u-blox latest technology.

VSI launches the first automotive industry-standard high-speed SerDes silicon

VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.

New PROVERTHA M12 angle adapters for X/D conversion save space in tight installation spaces

Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.

STMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules

Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.

STMicroelectronics simplifies sustainable product design with USB Type-C^® Power Delivery software for STM32 microcontrollers

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C^® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

International

Market Overview

Technical Articles

Case studies

Lineup also expanded to include two updated general-purpose MCR series shunt resistors.

Infineon is adding the XMC7000 series to its microcontroller portfolio. The new MCU family includes a single- or a dual-core Arm® Cortex®-M7 core, both with Arm® Cortex®-M0+ support.

Murata has broadened its portfolio of chip ferrite beads with the introduction of the BLM15PX_SH1 and BLM15PX_BH1 series. Supplied in a 1005 mm (0402 inch) size, these compact and rugged units are highly optimised for automobile deployment.

CEA-Leti presented three papers at IEDM 2022 detailing its recent advances and future challenges in quantum computing using Si-based qubit devices with FDSOI technologies. A plenary talk presented the path towards scalable quantum computers with silicon technology.

The ANT-B11 compact antenna board offers accurate direction finding and indoor positioning supported by u-blox latest technology.

VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.

Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.

Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

International

Infineon is adding the XMC7000 series to its microcontroller portfolio. The new MCU family includes a single- or a dual-core Arm^® Cortex^®-M7 core, both with Arm^® Cortex^®-M0+ support.

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C^® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.