10
'23
Written on
Thinesolutions News
10
'23
Written on
FEIG news
FEIG INTRODUCES NEW RFID HYBRID READER MODULE
With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.
09
'23
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Inova Semiconductors News
Inova Semiconductors is going to use Samsung Foundry Services for ISELED products
Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.
09
'23
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TDK News
TDK OFFERS NEW ULTRA-COMPACT SNAP-IN CAPACITOR SERIES WITH EXTREMELY HIGH CAPACITANCE DENSITY
Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.
09
'23
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SK Hynix News
SK HYNIX SHOWCASES SAMPLES OF WORLD’S FIRST 321-LAYER NAND
The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .
08
'23
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Teledyne Flir OEM
Teledyne FLIR Introduces Lepton 3.1R Radiometric Thermal Camera Module for Integrators
A Wider Field of View and Scene Temperature Range Enables People, Fire, and Condition Monitoring Applications.
08
'23
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Integrated Graphene News
Humans to provide energy source for smart devices of the future
Researchers from the Institute of Thin Films, Sensors and Imaging (ITFSI) from the University of the West of Scotland (UWS) explored the use of the 3D graphene foam material Gii by Integrated Graphene as an active layer in an energy generator.
08
'23
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Mouser News
Mouser Expands Range of Wireless Connectivity Products
Wireless connectivity is essential for various technologies, including automotive positioning and satellite-based IoT for remote assets, enabling robust communication and remote applications.
08
'23
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Infineon News
Automotive motor control: New MOTIX MCU embedded power IC-families with CAN FD interface provide faster communication and higher performance
Infineon Technologies AG introduces the TLE988x and TLE989x families extending the company’s comprehensive and proven portfolio of MOTIX MCU embedded power ICs.
08
'23
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Leuze
