25 {{ "2024-09-25T00:00:00+00:00" | date "MMM" }} '24

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Alphawave Semi News

Alphawave Semi and InnoLight Showcase 128Gbps PCIe Gen 7.0 over LPO at ECOC 2024

Alphawave Semi has announced an extension of its collaboration with InnoLight Technology, the leader in data center and AI networking optics, with a demonstration of next generation low power, low latency linear pluggable optics (LPO).

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25 {{ "2024-09-25T00:00:00+00:00" | date "MMM" }} '24

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CML Microcircuits News

CML launches sub-GHz band GaAs 2W linear power amplifier to ease UHF system development

CML Micro introduces the CMX90A006, a 2 W power amplifier designed for linear performance and reliability in wireless transmitter applications, extending its SµRF range of sub-GHz MMICs.

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25 {{ "2024-09-25T00:00:00+00:00" | date "MMM" }} '24

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Renesas News

Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs

New R-Car V4M & V4H SoC Devices Target High-Volume L2 and L2+ ADAS Market While Maintaining Scalability and Software Reusability with Existing R-Car Devices.

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25 {{ "2024-09-25T00:00:00+00:00" | date "MMM" }} '24

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Toshiba News

TOSHIBA INTRODUCES 32GBPS 2:1 MULTIPLEXER/1:2 DEMULTIPLEXER SWITCHES FOR HIGH-SPEED SIGNALS

1-lane 2-differential channel switches support PCIe 5.0, USB4 and Thunderbolt 4 interfaces for connecting and expanding peripheral devices in PCs, server equipment, and mobile devices.

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24 {{ "2024-09-24T00:00:00+00:00" | date "MMM" }} '24

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Broadcom News

BROADCOM DELIVERS INDUSTRY-LEADING 200G/LANE DSP FOR GEN AI INFRASTRUCTURE

Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next-generation AI clusters.

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24 {{ "2024-09-24T00:00:00+00:00" | date "MMM" }} '24

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Nvidia News

NVIDIA AI AERIAL LAUNCHES TO OPTIMIZE WIRELESS NETWORKS, DELIVER NEW GENERATIVE AI EXPERIENCES ON ONE PLATFORM

Supporting a growing ecosystem for AI-RAN, the new platform will transform radio access network (RAN) technology into AI-driven computing infrastructure.

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23 {{ "2024-09-23T00:00:00+00:00" | date "MMM" }} '24

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Molex News

Molex Unveils VaporConnect Optical Feedthrough Modules for Enhanced Thermal Management in AI Data Centers

Molex has introduced a thermal management solution that reduces the time and cost of deploying and upgrading high-performance data centers to meet unrelenting demand for generative AI and machine learning workflows.

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23 {{ "2024-09-23T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

OptiMOS 6 135 V and 150 V MOSFETs enable higher efficiency in drives and SMPS applications

Infineon Technologies AG expands its OptiMOS 6 MOSFET portfolio with the new 135 V and 150 V product families.

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23 {{ "2024-09-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-23T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Unveils Compact High-Voltage Power Stage with Evaluation Board for Enhanced Motor Drives

STMicroelectronics has introduced the PWD5T60 three-phase driver, a ready-to-use evaluation board, to accelerate the development of energy-efficient fans and pumps.

Read more…

23 {{ "2024-09-23T00:00:00+00:00" | date "MMM" }} '24

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Rutronik News

Rutronik Introduces OMRON's G9KC Four-Pole Power Relay with Superior Contact Resistance

Rutronik introduces the G9KC, a four-pole power relay from OMRON's portfolio, with a capacity of 480 VAC at 40 A and a maximum initial contact resistance of 6 mΩ.

Read more…

Alphawave Semi has announced an extension of its collaboration with InnoLight Technology, the leader in data center and AI networking optics, with a demonstration of next generation low power, low latency linear pluggable optics (LPO).

CML Micro introduces the CMX90A006, a 2 W power amplifier designed for linear performance and reliability in wireless transmitter applications, extending its SµRF range of sub-GHz MMICs.

New R-Car V4M & V4H SoC Devices Target High-Volume L2 and L2+ ADAS Market While Maintaining Scalability and Software Reusability with Existing R-Car Devices.

1-lane 2-differential channel switches support PCIe 5.0, USB4 and Thunderbolt 4 interfaces for connecting and expanding peripheral devices in PCs, server equipment, and mobile devices.

Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next-generation AI clusters.

Supporting a growing ecosystem for AI-RAN, the new platform will transform radio access network (RAN) technology into AI-driven computing infrastructure.

Molex has introduced a thermal management solution that reduces the time and cost of deploying and upgrading high-performance data centers to meet unrelenting demand for generative AI and machine learning workflows.

Infineon Technologies AG expands its OptiMOS 6 MOSFET portfolio with the new 135 V and 150 V product families.

STMicroelectronics has introduced the PWD5T60 three-phase driver, a ready-to-use evaluation board, to accelerate the development of energy-efficient fans and pumps.

Rutronik introduces the G9KC, a four-pole power relay from OMRON's portfolio, with a capacity of 480 VAC at 40 A and a maximum initial contact resistance of 6 mΩ.

International