Demonstrations highlighting leadership in PCIe over Optics, Ethernet, PCIe and UCIe SerDes on 3nm TSMC CoWoS packaging. Dr. Tony Chan Carusone to present workshop on I/O for AI clusters.
At the Engineering Design Show (EDS) in Coventry on the 9th and 10th October 2024, Powell Electronics will be showing the latest product solutions from some if its key franchises.
State-of-the-art protection certified to latest standard for information security certification, globally recognized and mandatory for US federal procurement.
Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, Multi-Billion-Dollar Collaboration Accelerates Development of Chip Manufacturing in Ohio.
In order to further drive decarbonization, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions.