17 {{ "2024-10-17T00:00:00+00:00" | date "MMM" }} '24

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Würth Elektronik News

WÜRTH ELEKTRONIK PRESENTS ITS NEW USB SOCKET

Used exclusively for power transmission, it supports the USB Power Delivery (USB-PD) communication protocol for adaptive charging up to 240 W.

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16 {{ "2024-10-16T00:00:00+00:00" | date "MMM" }} '24

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Micron News

Micron Fuels New Wave of AI PCs With Launch of Ultra-Fast Clock Driver DDR5 Memory Portfolio

Offering speeds up to 6,400 MT/s, two times faster than DDR4, Micron’s first-ever CUDIMM and CSODIMM memory solutions offer the performance boost needed for AI computing.

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16 {{ "2024-10-16T00:00:00+00:00" | date "MMM" }} '24

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Nvidia News

NVIDIA Contributes Blackwell Platform Design to Open Hardware Ecosystem

NVIDIA to share portions of GB200 NVL72 system, including rack architecture, compute & switch tray mechanicals, liquid-cooling and more, to support higher compute density & networking bandwidth.

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16 {{ "2024-10-16T00:00:00+00:00" | date "MMM" }} '24

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Kontron News

Kontron's Single Board Computer 3.5”-SBC-RPL with 13th Gen Intel^® Core™ U-Series Processors

A High-performance & High-efficiency Platform for AI-enabled IoT Edge Applications.

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16 {{ "2024-10-16T00:00:00+00:00" | date "MMM" }} '24

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NOVOSENSE News

NOVOSENSE to Present Latest Developments for Intelligent Vehicles, Electrification and Industrial Control at Electronica 2024

Showcasing advanced 40V multi-channel half-bridge drivers, high-performance programmable stepper motor drivers, and precision automotive sensors.

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16 {{ "2024-10-16T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

HybridPACK™ Drive G2 Fusion: Infineon combines silicon and silicon carbide in a cutting-edge power module for e-mobility

Affordability combined with high performance and efficiency is the key to making electric mobility accessible to a broader market.

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15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

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TDK News

TDK introduces xEVCap, a standardized and modular DC link capacitor design for xEV traction inverters

The xEVCap, design for powertrain inverters in passenger cars, commercial and off-highway vehicles, and machinery tools.

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15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

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Navitas News

Navitas GaNSlim Power ICs Drive Ease-of-use, System Cost, and Energy Savings in Mobile, Consumer, and Home Appliance

Highly integrated GaN power ICs with autonomous EMI control and loss-less sensing are the industry’s fastest, smallest, and most efficient solution in an optimized DPAK-4L package.

Read more…

15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

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ASUS News

ASUS Unveils ROG Maximus, ROG Strix, TUF Gaming, Prime, and ProArt Z890 Motherboards

These motherboards are ready for Intel Core Ultra Processors (Series 2) and advanced AI, with ultrafast connectivity, intelligent features, and high performance.

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15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

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MIkroe News

MIKROE Expands NXP's FRDM-MCXN947 Capabilities with New Shield for Enhanced Click Integration

MIKROE's new Click Shield expands NXP FRDM-MCXN947's potential, enabling integration with over 1700 Click boards™ for rapid development across IoT, industrial, and automotive applications.

Read more…

Used exclusively for power transmission, it supports the USB Power Delivery (USB-PD) communication protocol for adaptive charging up to 240 W.

Offering speeds up to 6,400 MT/s, two times faster than DDR4, Micron’s first-ever CUDIMM and CSODIMM memory solutions offer the performance boost needed for AI computing.

NVIDIA to share portions of GB200 NVL72 system, including rack architecture, compute & switch tray mechanicals, liquid-cooling and more, to support higher compute density & networking bandwidth.

A High-performance & High-efficiency Platform for AI-enabled IoT Edge Applications.

Showcasing advanced 40V multi-channel half-bridge drivers, high-performance programmable stepper motor drivers, and precision automotive sensors.

Affordability combined with high performance and efficiency is the key to making electric mobility accessible to a broader market.

The xEVCap, design for powertrain inverters in passenger cars, commercial and off-highway vehicles, and machinery tools.

Highly integrated GaN power ICs with autonomous EMI control and loss-less sensing are the industry’s fastest, smallest, and most efficient solution in an optimized DPAK-4L package.

These motherboards are ready for Intel Core Ultra Processors (Series 2) and advanced AI, with ultrafast connectivity, intelligent features, and high performance.

MIKROE's new Click Shield expands NXP FRDM-MCXN947's potential, enabling integration with over 1700 Click boards™ for rapid development across IoT, industrial, and automotive applications.

International