15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Toshiba News

Toshiba Pioneers 12-Disk HDD Stacking Technology

By combining 12-disk stacking with MAMR innovation, Toshiba aims to target 40TB-class 3.5-inch hard drives by 2027, thereby enhancing density, durability, and efficiency for next-generation data centres.

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15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Yamaha Motor News

Yamaha boosts surface-mount programming efficiency with latest software release

Yamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Mediatek News

MediaTek Co-Designs NVIDIA DGX Spark Superchip

The GB10 Superchip co-designed by MediaTek delivers 1 PFLOP of AI performance to the NVIDIA DGX Spark desktop AI supercomputer for accelerating large AI model work.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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TDK News

TDK Lambda Unveils New Modular Power Supply

TDK-Lambda's MU6 modular power supply offers up to 1500W with extremely low acoustic noise and BF-ready medical isolation, all within a compact footprint.

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15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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AMD News

AMD Unveils “Helios” Open Rack Platform for Scalable AI Infrastructure

Showcased at OCP Global Summit 2025, the Helios platform supports gigawatt-scale AI data centers with open, liquid-cooled, double-wide racks.

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15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Fraunhofer News

New Tool for Next-Generation Microdisplays

Fraunhofer IPMS unveils a new EdgeVision Microdisplay technology improving efficiency and quality in high-resolution microdisplay production, with results showcased at the SID-MEC Conference, from November 3 to 4, 2025, in Göttingen.

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15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Broadcom News

Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powering the AI Era

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

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15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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STMicroelectronics News

STMicroelectronics advances power solutions for 800 VDC architecture for next-generation AI factories

Solution leverages ST power chip portfolio by combining silicon carbide (SiC), gallium nitride (GaN),and silicon technologies with advanced custom design at both chip and package levels.

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15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Power Integrations News

Power Integrations Unveils 1250 V and 1700 V PowiGaN for 800 VDC AI Data Centers

The company collaborates with NVIDIA to advance 800 VDC power architectures, highlighting over 98% efficiency and superior power density versus SiC and lower-voltage GaN solutions.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

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Microchip News

Microchip Unveils 3 nm PCIe Gen 6 Switch

PCIe 6.0 doubles the bandwidth of PCIe 5.0 to 64 GT/s (giga transfers per second) per lane, providing the necessary data pipeline to keep the most powerful AI accelerators consistently supplied.

Read more…

By combining 12-disk stacking with MAMR innovation, Toshiba aims to target 40TB-class 3.5-inch hard drives by 2027, thereby enhancing density, durability, and efficiency for next-generation data centres.

Yamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.

The GB10 Superchip co-designed by MediaTek delivers 1 PFLOP of AI performance to the NVIDIA DGX Spark desktop AI supercomputer for accelerating large AI model work.

TDK-Lambda's MU6 modular power supply offers up to 1500W with extremely low acoustic noise and BF-ready medical isolation, all within a compact footprint.

Showcased at OCP Global Summit 2025, the Helios platform supports gigawatt-scale AI data centers with open, liquid-cooled, double-wide racks.

Fraunhofer IPMS unveils a new EdgeVision Microdisplay technology improving efficiency and quality in high-resolution microdisplay production, with results showcased at the SID-MEC Conference, from November 3 to 4, 2025, in Göttingen.

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

Solution leverages ST power chip portfolio by combining silicon carbide (SiC), gallium nitride (GaN),and silicon technologies with advanced custom design at both chip and package levels.

The company collaborates with NVIDIA to advance 800 VDC power architectures, highlighting over 98% efficiency and superior power density versus SiC and lower-voltage GaN solutions.

PCIe 6.0 doubles the bandwidth of PCIe 5.0 to 64 GT/s (giga transfers per second) per lane, providing the necessary data pipeline to keep the most powerful AI accelerators consistently supplied.

International