01 {{ "2024-10-01T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon introduces the industry's first 20 Gbps universal USB peripheral controller

Infineon Technologies AG announced the addition of the EZ-USB™ FX20 programmable USB peripheral controller to its EZ-USB product family.

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01 {{ "2024-10-01T00:00:00+00:00" | date "MMM" }} '24

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TDK News

Introducing AC programmable power with the launch of the new GENESYS™ AC and GENESYS™ AC PRO

TDK Corporation announces the introduction of the TDK-Lambda brand GENESYS™ AC (GAC) and GENESYS™ AC PRO (GAC-PRO) series of 2kVA and 3kVA rated programmable AC power sources.

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01 {{ "2024-10-01T00:00:00+00:00" | date "MMM" }} '24

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Samsung News

Samsung Launches 990 EVO Plus SSD with Enhanced Capacity and Performance via PCIe 4.0

With capacities of up to 4TB, 73% better power efficiency and random read and write speeds of 1,050K IOPS and 1,400K IOPS respectively, the 990 EVO Plus offers the best-in-class SSD experience to consumers, workers and gamers alike.

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01 {{ "2024-10-01T00:00:00+00:00" | date "MMM" }} '24

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Alphawave Semi News

Alphawave Semi Launches First Silicon-Proven 3nm UCIe IP Subsystem with TSMC CoWoS Technology

Alphawave Semi has unveiled the availability of the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem, built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.

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30 {{ "2024-09-30T00:00:00+00:00" | date "MMM" }} '24

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Baumer News

Vision 2024: Baumer pushes RDMA and inspecting the invisible

The special Baumer product highlighted at Vision 2024 include new developments with RDMA technology, SWIR and UV cameras as well as smart and embedded cameras.

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30 {{ "2024-09-30T00:00:00+00:00" | date "MMM" }} '24

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Tektronix News

Tektronix Launches New Products at electronica 2024

Tektronix has announced its participation at this year’s electronica 2024 exhibition, taking place in Munich from November 12-15, 2024, where it will reveal exciting products for the power ecosystem.

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30 {{ "2024-09-30T00:00:00+00:00" | date "MMM" }} '24

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PickeringTest News

Pickering Interfaces Showcases PXI-Based Switching and Simulation at Battery Tech Expo 2024

Pickering Interfaces will showcase its modular signal switching and sensor simulation solutions for electronics test and verification at Battery Tech Expo 2024 in Gothenburg, Sweden, on October 10th.

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27 {{ "2024-09-27T00:00:00+00:00" | date "MMM" }} '24

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SK Hynix News

SK HYNIX BEGINS VOLUME PRODUCTION OF THE WORLD’S FIRST 12-LAYER HBM3E

DRAM chips made 40% thinner to increase capacity by 50% at the same thickness as the previous 8-layer product.

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26 {{ "2024-09-26T00:00:00+00:00" | date "MMM" }} '24

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ANSYS News

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors.

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26 {{ "2024-09-26T00:00:00+00:00" | date "MMM" }} '24

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ams OSRAM News

ALIYOS™ LED-on-foil technology redefines automotive lighting for ams OSRAM

The technology enables ams OSRAM to apply LEDs onto a thin, flexible and transparent substrate. This advancement paves the way for light to emerge from surfaces, offering a truly fascinating and interactive experience.

Read more…

Infineon Technologies AG announced the addition of the EZ-USB™ FX20 programmable USB peripheral controller to its EZ-USB product family.

TDK Corporation announces the introduction of the TDK-Lambda brand GENESYS™ AC (GAC) and GENESYS™ AC PRO (GAC-PRO) series of 2kVA and 3kVA rated programmable AC power sources.

With capacities of up to 4TB, 73% better power efficiency and random read and write speeds of 1,050K IOPS and 1,400K IOPS respectively, the 990 EVO Plus offers the best-in-class SSD experience to consumers, workers and gamers alike.

Alphawave Semi has unveiled the availability of the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem, built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.

The special Baumer product highlighted at Vision 2024 include new developments with RDMA technology, SWIR and UV cameras as well as smart and embedded cameras.

Tektronix has announced its participation at this year’s electronica 2024 exhibition, taking place in Munich from November 12-15, 2024, where it will reveal exciting products for the power ecosystem.

Pickering Interfaces will showcase its modular signal switching and sensor simulation solutions for electronics test and verification at Battery Tech Expo 2024 in Gothenburg, Sweden, on October 10th.

DRAM chips made 40% thinner to increase capacity by 50% at the same thickness as the previous 8-layer product.

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors.

The technology enables ams OSRAM to apply LEDs onto a thin, flexible and transparent substrate. This advancement paves the way for light to emerge from surfaces, offering a truly fascinating and interactive experience.

International