NeoCortec's CEO will present on NeoMesh on LoRa, a technology that combines true mesh networking with LoRa's long-range capabilities to enhance reliability and power efficiency.
First to adopt High-K Epoxy Molding Compound, SK hynix enhances mobile DRAM with 3.5 times higher thermal conductivity and 47% lower thermal resistance, addressing heat challenges from on-device AI workloads.
Microchip's new GNSS Disciplined Oscillator Modules make it simple to integrate Position, Navigation and Timing (PNT) technology into a wide range of applications.
Toshiba and SICC have signed an MOU to improve the quality and characteristics of SiC power semiconductor wafers, ensuring a stable supply for the growing demand in AI data centers.