03 {{ "2025-10-03T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-03T00:00:00+00:00" | date "longDate" }}

TDK News

TDK Develops AI Chip for Real-Time Learning

TDK and Hokkaido University developed an analog reservoir AI chip prototype that mimics the cerebellum, enabling real-time learning and high-speed, low-power processing for edge AI applications like human interfaces.

Read more…

03 {{ "2025-10-03T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-03T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon launches industry-first TLVR power module for AI data centers

New dual-phase module delivers 140A output, 50% PDN loss reduction, ultra-fast transient response, and improved efficiency to meet AI growth demands.

Read more…

03 {{ "2025-10-03T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-03T00:00:00+00:00" | date "longDate" }}

MvTec News

MVTec Highlights Machine Vision Advancements for Semiconductor Quality & Efficiency

MVTec presents HALCON, MERLIC, and Deep Learning Tool, boosting defect detection, traceability, precision, and production speed while reducing waste.

Read more…

03 {{ "2025-10-03T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-03T00:00:00+00:00" | date "longDate" }}

ByteSnap Design News

ByteSnap Unveils OMaaS for Smarter Component Obsolescence Management

Proactive BOM monitoring and lifecycle tracking help UK manufacturers prevent disruptions, reduce administrative workload, and focus on innovation instead of reactive obsolescence firefighting.

Read more…

03 {{ "2025-10-03T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-03T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Showcases Industry-Leading Quality and Reliability of Co-Packaged Optics

As hyperscale data centers push beyond 51.2 Tb/s switch bandwidth, CPO offers a sustainable path forward by addressing the power constraints and physical limitations of traditional pluggable optics.

Read more…

02 {{ "2025-10-02T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-02T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay Intertechnology Power Metal Strip Resistor Delivers Power to 5 W in Compact 1206 Case Size

Offering High Power Density of > 650 W/in2, Space-Saving Device Provides Low Resistance Down to 0.3 mΩ to Increase Efficiency.

Read more…

02 {{ "2025-10-02T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-02T00:00:00+00:00" | date "longDate" }}

Rutronik News

Rutronik Expands Portfolio with KEMET ALV70 High-voltage Capacitors

750 V snap-in electrolytic capacitors deliver durability, high ripple resistance, and reliability for demanding industrial and energy applications.

Read more…

02 {{ "2025-10-02T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-02T00:00:00+00:00" | date "longDate" }}

TDK News

TDK-Lambda Launches 40W DIN Rail Power Supply

TDK-Lambda has introduced the DRB40-24-1, a compact 40W DIN rail power supply with a 24V output, which is designed for robust and reliable operation in challenging industrial and process control environments.

Read more…

02 {{ "2025-10-02T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-02T00:00:00+00:00" | date "longDate" }}

AMD News

IBM & AMD Partner with Zyphra to Advance AI Infrastructure

IBM and AMD supply Zyphra with MI300X GPU clusters on IBM Cloud, enabling large-scale multimodal AI model training and innovation.

Read more…

01 {{ "2025-10-01T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-01T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Würth Elektronik presents its Tarvos e and Olis e radio modules

Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.

Read more…

Market Overview

The 5G RedCap Connects IoT Devices at Lower Cost

Technical Articles

How Solar Radiation Disrupts Electronic Systems and What Solutions Can Protect Them

Case studies

CompControl automates inbound electronics logistics with machine vision

TDK Develops AI Chip for Real-Time Learning

TDK and Hokkaido University developed an analog reservoir AI chip prototype that mimics the cerebellum, enabling real-time learning and high-speed, low-power processing for edge AI applications like human interfaces.

Infineon launches industry-first TLVR power module for AI data centers

New dual-phase module delivers 140A output, 50% PDN loss reduction, ultra-fast transient response, and improved efficiency to meet AI growth demands.

MVTec Highlights Machine Vision Advancements for Semiconductor Quality & Efficiency

MVTec presents HALCON, MERLIC, and Deep Learning Tool, boosting defect detection, traceability, precision, and production speed while reducing waste.

ByteSnap Unveils OMaaS for Smarter Component Obsolescence Management

Proactive BOM monitoring and lifecycle tracking help UK manufacturers prevent disruptions, reduce administrative workload, and focus on innovation instead of reactive obsolescence firefighting.

Broadcom Showcases Industry-Leading Quality and Reliability of Co-Packaged Optics

As hyperscale data centers push beyond 51.2 Tb/s switch bandwidth, CPO offers a sustainable path forward by addressing the power constraints and physical limitations of traditional pluggable optics.

Vishay Intertechnology Power Metal Strip Resistor Delivers Power to 5 W in Compact 1206 Case Size

Offering High Power Density of > 650 W/in2, Space-Saving Device Provides Low Resistance Down to 0.3 mΩ to Increase Efficiency.

Rutronik Expands Portfolio with KEMET ALV70 High-voltage Capacitors

750 V snap-in electrolytic capacitors deliver durability, high ripple resistance, and reliability for demanding industrial and energy applications.

TDK-Lambda Launches 40W DIN Rail Power Supply

TDK-Lambda has introduced the DRB40-24-1, a compact 40W DIN rail power supply with a 24V output, which is designed for robust and reliable operation in challenging industrial and process control environments.

IBM & AMD Partner with Zyphra to Advance AI Infrastructure

IBM and AMD supply Zyphra with MI300X GPU clusters on IBM Cloud, enabling large-scale multimodal AI model training and innovation.

Würth Elektronik presents its Tarvos e and Olis e radio modules

Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.

International

Market Overview

Technical Articles

Case studies

TDK and Hokkaido University developed an analog reservoir AI chip prototype that mimics the cerebellum, enabling real-time learning and high-speed, low-power processing for edge AI applications like human interfaces.

New dual-phase module delivers 140A output, 50% PDN loss reduction, ultra-fast transient response, and improved efficiency to meet AI growth demands.

MVTec presents HALCON, MERLIC, and Deep Learning Tool, boosting defect detection, traceability, precision, and production speed while reducing waste.

Proactive BOM monitoring and lifecycle tracking help UK manufacturers prevent disruptions, reduce administrative workload, and focus on innovation instead of reactive obsolescence firefighting.

As hyperscale data centers push beyond 51.2 Tb/s switch bandwidth, CPO offers a sustainable path forward by addressing the power constraints and physical limitations of traditional pluggable optics.

Offering High Power Density of > 650 W/in2, Space-Saving Device Provides Low Resistance Down to 0.3 mΩ to Increase Efficiency.

750 V snap-in electrolytic capacitors deliver durability, high ripple resistance, and reliability for demanding industrial and energy applications.

TDK-Lambda has introduced the DRB40-24-1, a compact 40W DIN rail power supply with a 24V output, which is designed for robust and reliable operation in challenging industrial and process control environments.

IBM and AMD supply Zyphra with MI300X GPU clusters on IBM Cloud, enabling large-scale multimodal AI model training and innovation.

Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.

International

Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.