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STMicroelectronics News
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TDK News
TDK presents PoDL daughter cards for Analog Devices’ SPE evaluation boards
TDK Corporation announces a series of 10BASE-T1L plug-and-play test boards, called EVB-DLA-00x.
18
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Congatec News
Compact module delivers 39 TOPS AI performance
congatec presents new COM Express Compact modules with AMD Ryzen Embedded 8000 Series for high-performance AI applications at the edge.
17
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Intel News
Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing
Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, Multi-Billion-Dollar Collaboration Accelerates Development of Chip Manufacturing in Ohio.
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Infineon News
Infineon introduces the XENSIV™ PAS CO2 5V sensor for higher energy efficiency and improved air quality in buildings
In order to further drive decarbonization, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions.
17
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Vishay News
Vishay Intertechnology Expands Inductor Product Line
Vishay adds more size variations, ensuring that customers can find suitable inductors for any available PCB space.
17
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Alliance Memory News
Alliance Memory's New 16Gb LPDDR4X SDRAM Delivers High Performance and Efficiency
Alliance Memory introduces a new 16Gb LPDDR4X device, offering high-speed CMOS mobile low-power SDRAMs with increased clock speeds and data rates in a 200-ball FBGA package.
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Toshiba News
Toshiba introduces automotive photocoupler with output withstand voltage of 900V (min)
TLX9152M enables carmakers to replace mechanical relays for high-voltage isolation in EV powertrains and facilitates BMS monitoring.
17
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Rutronik Info
Power-saving SiP for cellular IoT applications
Rutronik now offers the nRF9151 from Nordic Semiconductor.
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Landi Renzo S.p.A.
