SVS-Vistek's SenSWIR FXO cameras use a 400-1700 nm range to identify subsurface wafer flaws, offering 5.2MP resolution and TEC cooling for high-speed inspection.
Utilizing RC-IGBTs, the new Mitsubishi Electric DIPIPM module's footprint is nearly 53% smaller than conventional Mini DIPIPM Ver.7 series, enabling more compact designs.
Deca and SST, a Microchip subsidiary, combine SuperFlash, M-Series fan-out, and Adaptive Patterning technologies to deliver modular NVM chiplets for scalable, efficient multi-die semiconductor architectures.
aReady.COM is congatec’s streamlined solution to accelerate embedded system development that delivers pre-integrated and pre-validated hardware and software building blocks.
Anritsu has introduced a new Receiver Test Solution for USB4 Version 2.0, enabling evaluation of devices with an 80 Gbit/s data transmission speed to support high-capacity data transfer.