13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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Exxelia

Exxelia will present its new products at the Electronica show and unveil its new website

Exxelia will be present at the Electronica 2024 show in Munich on booth A5/319, and at the same time announces the launch of its new website, designed to offer an improved user experience.

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13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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Delta Electronics

Delta D-Bot Series Cobots Now Integrate with NVIDIA Omniverse

This integration empowers developers to achieve real-time, high-fidelity, physically accurate simulations that dramatically enhance the development, testing, and deployment of advanced robotic solutions.

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13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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Toshiba News

Toshiba Debuts 1200V SiC MOSFETs for Automotive Inverters

The X5M007E120 offers ultra-low resistance, enhanced reliability, and energy efficiency for electric vehicles, enabling custom solutions with its bare die format and innovative Schottky diode integration.

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13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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AMD News

AMD Unveils Versal Premium Series Gen 2 for Advanced System Acceleration

The industry-first adaptive SoC features CXL 3.1, PCIe Gen6, and LPDDR5X support, delivering faster data movement, enhanced memory utilization, and secure connectivity for data-intensive applications.

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13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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TDK News

TDK presents second-generation 6-axis IMUs for advanced driver assistance and safety applications

TDK Corporation further extends its InvenSense SmartAutomotive™ MEMS sensor family with the IAM-20685HP and IAM-20689 second generation 6-axis IMUs for automotive safety applications.

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13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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Renesas News

Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs, Including First Low-Power Device with 14-Bit SAR ADC

Devices Reduce Component Count, BOM Cost and Board Space in Almost Any Application.

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13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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Micron News

Micron Introduces World’s Fastest, Most Energy Efficient 60TB SSD

The industry’s first E3.S 60TB SSD, the Micron ION 6550 delivers best-in-class energy efficiency at up to 67% more density per rack for exascale data centers.

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13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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TE Connectivity News

TE Connectivity helps to lead implementation of new SPE connector standards with the PROFIBUS Nutzerorganisation

As an advocate for Single Pair Ethernet, TE played a key role in the realization of a uniform connector system for PROFINET over SPE.

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13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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Anritsu News

Anritsu joins OpenROADM as Test & Measurement instrument vendor

Anritsu Corporation has joined the OpenROADM Multi-Source Agreement (MSA), which defines specifications that facilitate multi-vendor interoperability for optical transmission networks.

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13 {{ "2024-11-13T00:00:00+00:00" | date "MMM" }} '24

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U Blox News

u-blox launches tri-radio module that delivers the latest wireless technologies for IoT implementations

The u-blox MAYA-W4 combines Wi-Fi^® 6, Bluetooth^® LE 5.4 and 802.15.4 for reliable, ubiquitous and secure connectivity for the IoT ecosystem.

Read more…

Exxelia will be present at the Electronica 2024 show in Munich on booth A5/319, and at the same time announces the launch of its new website, designed to offer an improved user experience.

This integration empowers developers to achieve real-time, high-fidelity, physically accurate simulations that dramatically enhance the development, testing, and deployment of advanced robotic solutions.

The X5M007E120 offers ultra-low resistance, enhanced reliability, and energy efficiency for electric vehicles, enabling custom solutions with its bare die format and innovative Schottky diode integration.

The industry-first adaptive SoC features CXL 3.1, PCIe Gen6, and LPDDR5X support, delivering faster data movement, enhanced memory utilization, and secure connectivity for data-intensive applications.

TDK Corporation further extends its InvenSense SmartAutomotive™ MEMS sensor family with the IAM-20685HP and IAM-20689 second generation 6-axis IMUs for automotive safety applications.

Devices Reduce Component Count, BOM Cost and Board Space in Almost Any Application.

The industry’s first E3.S 60TB SSD, the Micron ION 6550 delivers best-in-class energy efficiency at up to 67% more density per rack for exascale data centers.

As an advocate for Single Pair Ethernet, TE played a key role in the realization of a uniform connector system for PROFINET over SPE.

Anritsu Corporation has joined the OpenROADM Multi-Source Agreement (MSA), which defines specifications that facilitate multi-vendor interoperability for optical transmission networks.

The u-blox MAYA-W4 combines Wi-Fi® 6, Bluetooth® LE 5.4 and 802.15.4 for reliable, ubiquitous and secure connectivity for the IoT ecosystem.

International

The u-blox MAYA-W4 combines Wi-Fi^® 6, Bluetooth^® LE 5.4 and 802.15.4 for reliable, ubiquitous and secure connectivity for the IoT ecosystem.