02
'22
Written on
Anritsu News
02
'22
Written on
ST News
STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec (Euronext Paris), a leader in designing and manufacturing innovative semiconductor materials, announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
01
'22
Written on
NXP News
NXP’s NXH3675 Ultra-Low Power Bluetooth® Audio Solution Helps Revolutionize the Wireless Listening and Hearing Experience
Certified to the Bluetooth® 5.3 Low Energy (LE) audio standard, the NXH3675 enables high-quality, multi-stream wireless audio streaming with ultra-low power consumption and latency.
01
'22
Written on
Keysight technologies News
Keysight and MediaTek Achieve 5G Connection Based on 3GPP Release 17 and RedCap Technology
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that MediaTek has used Keysight's 5G Network Emulation Solutions to establish connectivity to its 5G chips using the 3GPP 5G Release 17 (Rel-17) and the 5G reduced capability (RedCap) specifications.
01
'22
Written on
ST News
STMicroelectronics boosts all-round performance in op amps for industrial and automotive environments
STMicroelectronics is simplifying designers’ search for high-performing operational amplifiers (op amps) by introducing three new 6MHz rail-to-rail devices with strong all-round parameters including a wide operating-voltage range and low noise.
01
'22
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ONSEMI News
electronica Recap: onsemi Unveils Strategic Collaboration and Takes Home Three Awards
Intriguing EV steals the show at onsemi’s electronica booth alongside award-winning products Top-Cool MOSFETs, NCS32100 and AR0147AT.
01
'22
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Qualcomm News
Understanding the Connected Intelligent Edge and its potential
Qualcomm President and CEO Cristiano Amon shares how his company is driving the emergence of the Connected Intelligent Edge.
01
'22
Written on
Mitsubishi Electric News
Mitsubishi Electric to Launch Contact Image Sensor in New KD-CXF Series
Mitsubishi Electric Corporation has announced that its new KD-CXF series of contact image sensors (CISs) equipped with the industry's deepest1 depth of field2 will launch this December beginning with the KD6R1064CXF-NL model. CISs are widely used in manufacturing to inspect product surfaces for scratches, dirt, miscoloring or mispositioning of printed labels, plastic film, etc.
01
'22
Written on
Metz Connect News
METZ CONNECT: MB-DIOX/Y-IP65 – ACQUISITION AND CONTROL OF ACTUATORS IN VENTILATION SYSTEMS
The MB-DIOx/y-IP65 module series in an IP65 housing with 2 or 4 digital inputs and 1 or 2 relay outputs is suitable for accommodating decentralized signal contacts and controlling decentralized switching tasks. As signal contacts, e.g. window contacts or the positions of ventilation flaps, etc. can be detected and controlled for switching tasks, e.g. motorized actuators or light bands, etc.
30
'22
Written on
Anritsu News
