26
'22
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NEC Corporation News
26
'22
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Telit News
Telit FN980 5G Module Approved for Use on NVIDIA Jetson AGX Orin Platform
Based on the 3GPP Rel. 15 standard, the FN980 is ideal for high-performance and bandwidth-intensive applications enabled by NVIDIA Jetson AGX Orin—the world’s most powerful, compact and energy-efficient AI supercomputer built for advanced robotics and autonomous machines, as well as edge computing.
26
'22
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Intel News
12th Gen Intel Core Powers New Framework Laptops
Framework has announced that its newest generation Framework Laptops – powered by the latest 12th Gen Intel® Core P-series processors – are available for pre-order. Framework’s 2nd generation systems feature up to 12th Gen Intel Core i7-1280P processors.
25
'22
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TDK News
TDK offers PhaseCap® Energy Plus PFC capacitors with significantly improved performance
TDK Corporation introduces PhaseCap® Energy Plus, two new series of EPCOS PFC capacitors. The B25674C* series is gas-impregnated and covers a voltage range from 230 V AC to 690 V AC and offers compensation ratings from 5 kvar to 33.1 kvar, depending on the type. The B25675C* series capacitors are impregnated with a biodegradable resin and are rated for voltages from 230 V AC to 1000 V AC, with compensation ratings of up to 60 kvar.
25
'22
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U Blox News
u-blox launches world’s smallest LTE Cat 4 module with global coverage and 2G/3G fallback
The LARA-L6 is a perfect fit for demanding size-constrained applications including video surveillance, dashcams, high-end telematics, gateways and routers, and connected health devices.
25
'22
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Mediatek News
MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity
MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas.
25
'22
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Qualcomm News
Qualcomm Unveils Next Generation Powerline Communication Device to Support Expanding Industry Need for Vehicle to Charging Station Smart-Grid Communications
Next Generation Powerline Communication Device Supports Global Efforts Towards E-Mobility and a Net-Zero Emissions Society.
25
'22
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E+E ELEKTRONIK News
Digital Temperature Sensing Element by E+E Elektronik
The TEE501 sensing element offers excellent measurement accuracy of up to ±0.2 °C and is easy to integrate thanks to its small DFN enclosure. Austrian sensor manufacturer E+E Elektronik presents its first digital temperature sensing element in the form of the TEE501. It impresses with a measurement accuracy of up to ±0.2 °C and a wide temperature range. The small DFN enclosure with integrated pull-up resistors facilitates the design-in of the sensing element.
25
'22
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Infineon News
Infineon introduces the highly-integrated and scalable wireless charging platform WLC with Qi-compliant and configurable controllers
The wireless charging market has been increasingly growing over the last years, with more and more applications applying this capability to make use of the offered benefits.
25
'22
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Teledyne Flir Machine Vision
