TDK Corporation announces the addition of the TDK-Lambda brand DTM70 and DTM160 series to the DTM family of compact medical and industrial AC-DC power adapters that are available in various power classes from 36W to 300W.
The new XTV terminal blocks are the first product on the market to incorporate Phoenix Contact’s breakthrough Push-X connection technology, which allows them to terminate conductors with cross sections extending from 6mm2 to 16mm2 quickly, easily, reliably, and almost effortlessly.
Embedded systems and display solutions provider, Review Display Systems Inc, has announced the introduction of an AMD-powered mini-STX single board computer from leading global provider of embedded technology, Kontron.
CUI Devices’ Motion and Control Group has announced the addition of a new line of potentiometers. Available in shaft or shaftless options, these rotary potentiometers feature resistance ratings from 1 to 2000 kΩ and panel mount or through hole mounting styles.
ROHM has recently announced the adoption of its new 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd, a leading Japanese automotive parts manufacturer.
Infineon Technologies AG today announced that Micross Components, Inc. (“Micross”) has entered a definitive agreement to purchase Infineon’s HiRel DC-DC converter business including its hybrid and custom board-based power products.
TDK Corporation announces the InvenSense SmartBug 2.0 with various new and exciting features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug.
The company joins forces with sixteen organizations to create 6G-SANDBOX, a pan-European testbed for 6G experimentation and validation of 5G-Advanced and 6G capabilities. As a part of 6G-SANDBOX, Keysight will act as the project coordinator.
Kontron introduces two COM-HPC® Clients, COMh-caRP and COMh-ccAS, based on 13th Gen Intel® Core processors mobile and desktop version. They offer a significant increase in performance compared to the previous generation and are equipped with 14 cores up to 24 cores with Intel® performance hybrid architecture.