30
'22
Written on
ST News
30
'22
Written on
Congatec News
Congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant.
30
'22
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Kontron News
Kontron and Napatech collaborate on optimized platform for 5G User Plane Function in telco edge data centers and private networks
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT) and of cloud and carrier-class integrated infrastructure platforms, and NapatechTM (OSLO: NAPA.OL).
29
'22
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Allied Electronics & Automation News
Allied Electronics & Automation Announces the new RS DesignSpark Accelerate Incubator Program
Based at the RS DesignSpark Innovation Center in Bryan-College Station, Texas, the new incubator program will provide startup companies involved in hardware and software solutions relevant to RS Group markets and technologies with a significant slate of benefits, including up to $50,000 of in-kind funding.
29
'22
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Infineon News
German Federal Printing Office, Fraunhofer and Infineon demonstrate for the first time electronic passport security for the quantum computer era
Quantum computers could become a serious threat to the security of documents such as electronic passports before the present decade is over.
29
'22
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ST News
STMicroelectronics achieves EMVCo certification for biometric-payment platform, cutting time-to-market for card issuers
ST’s complete certified technology platform combines embedded secure element and ultra-low-power general-purpose microcontroller for cost-effective and robust protection.
29
'22
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Texas Instruments News
TI expands space-grade product portfolio with radiation-hardened and radiation-tolerant plastic packages for missions from new space to deep space
Engineers can use new ADCs and power semiconductors to increase thermal efficiency and reduce system size and weight while meeting radiation and reliability requirements.
29
'22
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Qualcomm News
Introducing the Qualcomm Edgewise Suite for accelerating 5G rollouts and Open RAN adoption
Qualcomm Technologies, Inc. is focused on the realization of the connected intelligent edge, driving the convergence of wireless connectivity and efficient computing that enables the growth of a cloud-connected economy. An important cornerstone of this mission is the continuous innovation of breakthrough capabilities that can shape and modernize the architecture of radio networks.
28
'22
Written on
Infineon News
Infineon and TSMC to introduce RRAM technology for automotive AURIX TC4x product family
Infineon Technologies AG and TSMC today announced the companies are preparing to introduce TSMC’s Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology into Infineon’s next generation AURIX microcontrollers (MCU).
25
'22
Written on
dSPACE News
