Rohde & Schwarz and Broadcom have successfully validated the R&S CMP180 radio communication tester for Broadcom Wi-Fi 7 chipsets. OEMs and ODMs of wireless devices can now get their first Wi-Fi 7 products ready for market.
Analog Devices, Inc. invites the public and media to experience life at the Intelligent Edge through interactive demonstrations and expert discussions at CES 2023.
Vector presents its compact multi-gig USB-to-Ethernet adapter VN5601. The adapter is not only high performing, its compact dimensions make it ideally suited for portable use. It also offers easy connection to Vector Hardware.
TDK Corporation will showcase more than 30 technology demonstrations and experiences across its component and system solution portfolio for the entire spectrum of electronics applications at the 2023 Consumer Electronics Show (CES) in Las Vegas, Nevada, from January 5th through January 8th. Additionally, TDK plans to release multiple product and partner announcements for its InvenSense brand MEMS sensors throughout the week of the conference.
Congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini.
In recent years, DFI, the world leading brand in embedded motherboards and industrial computers, has actively implemented corporate sustainable management.
Delta, announced it has been selected for the Dow Jones Sustainability Indices World Index for the 12th consecutive year, not only scoring the highest overall performance in the global electronic equipment industry for the 7th year in a row, but also with the 100th percentile for the environmental and social dimensions of the industry.
Moxa’s newly launched AIG-100 Series includes best-in-class IIoT gateways that help achieve your IIoT targets with the lowest total cost of ownership by focusing on distributed-energy-resource applications, especially in solar energy and energy storage systems.