A reliable and safe transportation system is significant in improving the economic development, health, and well-being of the society. Today, countless people rely on public transportation to commute to healthcare services, whereas businesses depend on it to lower costs. NEXCOM reacts to the issue by introducing VES 31-4S/8S and VES 31-4SR/8SR, the fanless unmanaged mobile vehicle and railway PoE switch respectively.
CUI Devices’ Switches Group has announced the introduction of one of the industry’s smallest tactile switches. Housed in an ultra-compact 3 x 2 x 0.6 mm package, the TS19 series carries an IP67 rating for dealing with moisture and environmental contaminants as well as a rugged lifecycle rating up to 300,000 cycles.
TDK Corporation presents ModCapTM HF, a modular capacitor concept for DC link applications that is able to work at very high switching frequencies. The six newly developed power capacitors of the B25647A* series are available for rated voltages from 900 V to 1600 V and cover a capacitance spectrum from 640 µF to 1850 µF.
The design of future power electronic systems is continuously pushed to improve state-of-the-art performance and power density. Supporting this trend, Infineon Technologies AG launches a new Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants.
Melexis is expanding its range of automotive-qualified inductive resolvers for e-motor applications (power steering, traction motor, brake booster). The MLX90517 complements the MLX90510 by providing raw signals to enable off-chip compensation in the ECU.
Provides network equipment manufacturers and data center operators with an extensible cybersecurity test platform that supports hyperscale data volumes, encryption demands, and security challenges.
Combining high surge robustness with very low trigger and extremely low clamping voltages, the PESD4V0Y1BBSF and PESD4V0X2UM offer a highly effective solution for the protection of sensitive systems.
Aiming at Infineon’s latest AURIX TC4x the hardware support package for MathWorks Simulink® supports automotive engineers in designing advanced electric vehicles, sensor fusion, and radar signal processing functions, even before silicon is available. With the package, the designers can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.
Mitsubishi Electric Corporation announced that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023.
Toshiba Corporation has unveiled a technology breakthrough in photoluminescence, a novel phosphor that delivers excellent solubility in polymers or organic solvents, where it is transparent and colorless under visible light, and that emits persistent red-light emissions under UV light, with excellent color purity and a luminescence six times that of current phosphors.