Engineers can use new ADCs and power semiconductors to increase thermal efficiency and reduce system size and weight while meeting radiation and reliability requirements.
Qualcomm Technologies, Inc. is focused on the realization of the connected intelligent edge, driving the convergence of wireless connectivity and efficient computing that enables the growth of a cloud-connected economy. An important cornerstone of this mission is the continuous innovation of breakthrough capabilities that can shape and modernize the architecture of radio networks.
Infineon Technologies AG and TSMC today announced the companies are preparing to introduce TSMC’s Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology into Infineon’s next generation AURIX microcontrollers (MCU).
The SCALEXIO Ethernet boards provide additional Ethernet interfaces to the SCALEXIO Processing Unit, the SCALEXIO LabBox or the SCALEXIO AutoBox. Boards that offer native BroadR-Reach support and an integrated Ethernet switch are available for both platforms, and they can be configured via modules.
Through a new multiyear agreement, Ansys’ comprehensive simulation portfolio will empower Murata to develop cutting-edge, sustainable wireless connectivity products.
Innodisk, a leading global provider of industrial-grade flash storage, DRAM memory and embedded peripherals, has announced its latest step into the AI market, with the launch of EXMU-X261, an FPGA Machine Vision Platform. Powered by AMD’s Xilinx Kria K26 SOM, which was designed to enable smart city and smart factory applications, Innodisk’s FPGA Machine Vision Platform is set to lead the way for industrial system integrators looking to develop machine vision applications.
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announces the final remaining 2022 episode of its award-winning Empowering Innovation Together program.
Infineon Technologies AG and Fingerprint Cards AB (STO: FING B, Fingerprints) today announced the signing of a joint development and commercialization agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card.
ST has introduced LSM6DSV16X, the flagship 6-axis inertial measurement unit (IMU) embedding ST’s Sensor Fusion Low Power (SFLP) technology, Artificial Intelligence (AI), and adaptive-self-configuration (ASC) for superior power optimization.