At embedded world 2022, Congatec – a leading vendor of embedded and edge computing technology – and System Industrie Electronic – an ISO 13485 certified expert in system design and integration, mass production and assembly of medical OEM platforms – have officially launched their new co-creation services for the design of IT/ OT systems dedicated for the medical and healthcare sector.
Nexperia, the expert in essential semiconductors, today announced the latest addition to its family of voltage level translators, the NXT4557GU and NXT4556UP. These devices enable seamless connectivity of next generation low voltage mobile phone baseband processors with its subscribers’ identity module (SIM) cards.
TDK Corporation has introduced a thin pattern coil to support the wireless charging of next generation mobile devices. Industry-leading 0.76 ㎜ thickness achieved via unique pattern coil technology.
New class of processors with critical deterministic behavior of safe MCUs, but with unparalleled combination of gigahertz speed, multi-application isolation and memory expansion capabilities. Ideal for safe integration of cross-domain vehicle functions for software-defined vehicles.
With uEye XC, IDS Imaging Development Systems GmbH is launching an industrial camera with autofocus that is just as easy to operate as a webcam. Setting up and commissioning the 13 MP USB3 camera only requires a cable connection. It then immediately delivers high-resolution, detailed images and videos.
New SmartBond DA1470x Family Features Small Form Factor with Integrated Applications and 2D Graphics Processors, Voice Activity Detector and Power Management Enables Small Form Factor for IoT Product Designs.