11
'23
Written on
Infineon News
11
'23
Written on
TDK News
TDK announces SmartBug 2.0 - A smarter digital transformation module with Machine Learning-Enabled ICM-45686-S IMU
TDK Corporation announces the InvenSense SmartBug 2.0 with various new and exciting features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug.
11
'23
Written on
Keysight technologies News
Keysight Coordinates Pan-European 6G Testbed
The company joins forces with sixteen organizations to create 6G-SANDBOX, a pan-European testbed for 6G experimentation and validation of 5G-Advanced and 6G capabilities. As a part of 6G-SANDBOX, Keysight will act as the project coordinator.
11
'23
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Kontron News
COMH-CARP AND COMH-CCAS: KONTRON ADVANCES INDUSTRIAL HIGH-PERFORMANCE COMPUTING
Kontron introduces two COM-HPC® Clients, COMh-caRP and COMh-ccAS, based on 13th Gen Intel® Core processors mobile and desktop version. They offer a significant increase in performance compared to the previous generation and are equipped with 14 cores up to 24 cores with Intel® performance hybrid architecture.
10
'23
Written on
Keysight technologies News
Keysight, Qualcomm Accelerate 5G Non-Terrestrial Network Communication to Support Broadband in Remote Areas
Keysight Technologies, Inc, a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced it has collaborated with Qualcomm Technologies, Inc, to establish an end-to-end 5G non-terrestrial network connection.
10
'23
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Nexcom News
The In-Vehicle AI-Aided Telematics Computer, VTC 7260-xC4 Leads the Way
To cope with the boom of e-commerce and direct delivery trends, machine learning is currently greatly integrated into ADAS, public works, intelligent traffic system, and countless warehouse applications. Provided with advanced computing power, extension capability, and high connectivity, NEXCOM’s in-vehicle AI-aided telematics computer, VTC 7260-xC4 is used as the core of vehicles to help deploy applications like smart public transit, smart agriculture/construction, and automated intralogistics.
10
'23
Written on
TDK News
TDK redefines true wireless stereo applications with VibeSense360 solution suite
TDK Corporation expands its solution-focused offerings by announcing the InvenSense VibeSense360 TWS solution suite. VibeSense360 is a comprehensive portfolio of TDK solutions comprised of hardware and software dedicated to the TWS market.
10
'23
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ST News
STPOWER automotive-grade devices from STMicroelectronics run cooler in surface-mount ACEPACK SMIT package
STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.
09
'23
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ams OSRAM News
ams OSRAM releases industry leading 0.5Mpixel global shutter CMOS image sensors to save space and power in wearable and mobile devices
Ams OSRAM, a global leader in optical solutions, today extended its Mira family of pipelined, high- sensitivity, global shutter CMOS image sensors with the launch of the 2.3mm x 2.8mm, 0.5Mpixel Mira050.
09
'23
Written on
Infineon News
