Digi-Key’s upcoming webinar with SparkFun, Wurth Elektronik, HARTING and Analog Devices will provide insights on how to remotely monitor equipment with Single-Pair Ethernet (SPE). Event will feature experts from SparkFun, Würth Elektronik, HARTING and Analog Devices.
Vital to virtually every electronic application, electrical connectivity solutions transmit electrical current from an energy source to devices and equipment that use energy to perform a task.
Artificial Intelligence (AI) for wireless is already here, with applications in areas such as mobility management, sensing and localization, smart signaling, and interference management. Recently, Qualcomm Technologies prototyped the AI-enabled air interface and announced the Snapdragon X70 5G modem-RF, the world’s first 5G modem with a dedicated AI processor.
Siemens Digital Industries Software announced today availability of its leading Nucleus ReadyStart solution for embedded development targeting the fast-growing adoption of the RISC-V architecture.
The Contour2D sensor system enables optimally efficient detection of conveyor belt utilization. It is the only system on the market to require just one LiDAR sensor to do this.
Lane Electronics today announced it received a Silver Tier Award for exceptional performance and contributions to supply chain success for BAE Systems, Inc.’s Electronic Systems sector. Lane Electronics was honored at a virtual ceremony and was selected from the pool of suppliers that worked with BAE Systems in 2021.
TDK Corporation announced today that subsidiary TDK Ventures, Inc. has invested in wireless communications disruptor XCOM Labs to expedite the development of their 5G and wireless communications solutions, which emphasize bandwidth capacity, latency reduction/elimination, and compute load balancing.
Keysight, FormFactor, DMPI and VDI have jointly developed this new VNA solution to provide on-wafer millimeter-wave component characterization under various conditions. Enables customers to shorten design and verification cycles for 5G and emerging 6G applications.
Power Integrations, the leader in high-voltage integrated circuits (ICs) for energy-efficient power conversion, today announced an expanded offering of the InnoSwitch4-CZ family of high-frequency, zero-voltage switching (ZVS) flyback controller ICs. When paired with Power Integrations' ClampZero active-clamp IC and, optionally, the recently announced HiperPFS-5 GaN-based power-factor corrector, the new ICs easily address the latest USB PD 3.1 specification for adapters and chargers up to 220 W.