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NEC Corporation News

NEC becomes the first IT service provider to offer a connection point to Microsoft Azure ExpressRoute from its own data center

NEC Corporation today announced that the company will establish a connection point to Microsoft Azure ExpressRoute through a dedicated private network fiber connection to Azure provided by the NEC Inzai Data Center in Japan from June 2022.

ST News

2nd-generation multi-zone direct Time-of-Flight sensor from STMicroelectronics uses less energy and can range 2X as far as existing products

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has announced its newest FlightSense Time-of-Flight (ToF) ranging sensor for smart-phone camera management and augmented/virtual reality.

Rutronik Info

Gas sensor with artificial intelligence

Environmental sensor technology with artificial intelligence this is the first gas sensor with artificial intelligence and integrated highly linear and highly accurate pressure, humidity and temperature sensors. Bosch's BME688 complements the Rutronik sensors portfolio.

Diamond News

FIBER OPTIC VACUUM FEEDTHROUGHS

Diamond offers vacuum feedthrough (V-FT) solutions for a large range of optical fiber and adaptors. The V-FT integrates a standard 2.5mm ferrule permanently sealed in a normalized CF flange that can incorporate a variety of adaptors.

Nexcom News

NEXCOM Releases 5G uCPE for Multi-Access Edge Computing Deployments

NEXCOM, a leading supplier of network appliances, introduces FTA 1170, its new Intel-based uCPE powered by the Intel Atom® processor family. FTA 1170 is the centerpiece of the nexCPE product line, which addresses all requirements of the 5G core network and covers both wired and wireless broadband applications.

Mouser News

Mouser Electronics Examines Importance of Designing for Security in Third Empowering Innovation Together Episode

Mouser Electronics Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, launched the latest chapter of its award-winning Empowering Innovation Together program.

Exxelia

Exxelia expands its range of low profile aluminum electrolytic capacitors and defies high temperatures up to +125°C

Exxelia, a global manufacturer of complex passive components and subsystems for harsh environments, is expanding its CUBISIC capacitor range with a HTLP (High Temperature Low Profile) version. This CUBISIC HTLP offers, in a thin rectangular packaging, the highest energy density of capacitors in its class, combined with a high temperature resistance (-55° +125°C).

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