22
'22
Written on
Rutronik Info
22
'22
Written on
ANSYS News
Ansys Wins Prestigious Best Paper Award at the IEEE HOST Conference for Pioneering Semiconductor Security Solution
Ansys' paper on its solution to enable secure electronic designs won the Best Paper Award at the IEEE International Symposium on Hardware Oriented Security and Trust (HOST), the world-leading hardware security conference.
20
'22
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Allegro Micro Systems News
Allegro MicroSystems Announces New Distribution Partnership With Mouser Electronics
Allegro MicroSystems, Inc, a global leader in sensing and power solutions for motion control and energy-efficient systems, today announced that it has entered into a new distribution partnership with global semiconductor and electrical component distributor Mouser Electronics.
20
'22
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TTI News
TTI Europe adds TE Connectivity’s Industrial Mini I/O Connector to its Portfolio
Mini I/O connector provides superior performance in industrial applications.
20
'22
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Innoscience News
World's largest 8-inch GaN-on-Si device maker partners with German power electronics Innovation Hub
Innoscience signs distribution agreement with Finepower providing European & Chinese customers with specialist design-in support.
20
'22
Written on
Timestrip News
Timestrip Introduces New Technology Indicator
Timestrip has developed a completely new electronic indicator technology capable of highly versatile operation at low cost. The Timestrip neo is a platform for a series of single use electronic indicators suitable for pack level monitoring with both time and multiple temperature settings.
19
'22
Written on
IDS Imaging Development Systems GmbH
Precisely capture and monitor high-speed processes
Faster than any other IDS industrial camera: uEye Warp10 with 10GigE.
19
'22
Written on
TDK News
200w half-brick dc-dc converters feature a 12:1 ultra-wide input range for railway and industrial applications
TDK Corporation announces the introduction of the 200W TDK-Lambda brand PYH200 series of DC-DC converters. Featuring a 12:1 ultra-wide input range of 14 to 160Vdc, these board mount products are packaged in the industry-standard half-brick format measuring 61.0 x 57.9 x 12.7mm (L x W x H).
19
'22
Written on
Rohde & Schwarz
Rohde & Schwarz announces on-wafer device characterization test solution
Rohde & Schwarz now offers a test solution for full RF performance characterization of the DUT on-wafer which combines the powerful R&S ZNA vector network analyzer from Rohde & Schwarz with industry-leading engineering probe systems from FormFactor. As a result, semiconductor manufacturers can perform reliable and repeatable on-wafer device characterization in the development phase, during product qualification and in production.
19
'22
Written on
ST News
