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Bi-Ber News

New features for empty mould check

Bi-Ber has implemented several innovations in its optical inspection systems for empty mould check: additional interface options and software features as well as new hardware configurations.

Nexcom News

X200 Embedded Board Boosts Digital Transformation in AI Image Processing

In today’s technological advanced world, healthcare professionals have begun to rely on imaging data to detect, characterize and monitor diseases. Imaging technologies are able to assist qualified caregivers in performing timely and quality bedside services for inpatients.

Sensata Technologies News

Sensata Technologies’ New Smart-Tactor Contactors Provide Critical Data to Improve System Performance

Sensata Technologies (NYSE:ST), today announced the availability of the new GXC and MXC series of Smart-Tactor contactors with CAN bus communication which provide valuable data for improved system performance, reliability, and diagnostics in military, battery system, energy storage, commercial vehicle and industrial applications.

Infineon News

New OptiMOS power MOSFET package enables innovative Source-Down technology for PQFN 3.3 x 3.3 mm2 in 25 V to 100 V variants

High power density, optimized performance, and ease of use are key requirements when designing modern power systems. To offer practical solutions for design challenges in end applications, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the new generation of OptiMOS Source-Down (SD) power MOSFETs.

Toshiba News

TOSHIBA LAUNCHES HIGH PERFORMANCE ETHERNET PCIE® BRIDGE IC

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a new Ethernet bridge IC – the TC9563XBG -. It is intended for use in automotive zonal-architecture, infotainment, telematics or gateways as well as industrial equipment.

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