Breakthrough Intel® Core technology with ADLINK Computer-on-Modules allow for hybrid architecture performance and a wide variety of deployment scenarios with superior performance.
This camera module provides image output at a resolution of 18MP with great details. The e-CAM180_CUMI1820_MOD comes with 4 levels of zoom that allow users to swivel the camera from left to right, tilt it up and down, and zoom in and out of a scene.
The location-as-a-service (LaaS) company has invented and patented an award-winning tracking solution to determine indoor and outdoor locations of items, assets, and employees. Both companies fuse Deeyook’s ultra-precise, innovative algorithms into Infineon’s best-in-class, low power AIROC Wi-Fi® portfolio to enable an accurate, passive, ubiquitous, and efficient location solution.
Consumer Electronics Show -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, has announced that it has enhanced the software offerings and tool kits for its highly successful Bluebud wireless audio platform with the addition of Bluebud-HD, a pre-configured software package that includes all the audio, voice and context-aware software required in premium TWS earbuds, gaming headsets, hearables, wearables and other smart audio products.
NXP® Semiconductors (NASDAQ: NXPI) today announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases, and supports the new groundbreaking Matter connectivity protocol.
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), announces new boards and modules featuring the 12th Gen Intel® Core processors (Codename Alderlake-S series) for the Internet of Things. Kontron will update the current mini-ITX, µATX and ATX motherboards with this new processor series, and has also selected it as the 1st platform to adopt the new PICMG® COM-HPC®/Client form factor, as it serves best new technology trends set by COM-HPC® client specification.