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SK Hynix News

SK hynix and Solidigm Introduce First Collaborative Product

SK hynix and Solidigm jointly introduced their first collaborative product, a new enterprise solid-state drive (eSSD), P5530. This limited release product highlights the emerging partnership between SK hynix and Solidigm, which formed three months ago when SK hynix acquired Intel’s NAND and SSD business.

Comap News

InteliGen4 200 - A new generation controller for a more secure digital future

ComAp announces a new generation of its bestselling paralleling gen-set controller, InteliGen4 200. This successor to the InteliGen 200 keeps all the InteliGen 200‘s key features but enhances them focusing on three key areas: cyber security, remote communication, and additional flexibility and efficiency for application design.

Mouser News

Hear What’s New in Technology with Mouser Electronics’ Tech Between Us Podcast

Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces a new resource site dedicated to its engaging podcast episodes. The site features all episodes from the Empowering Innovation Together podcast series, The Tech Between Us, and will serve as a central hub for all future podcast episodes produced by Mouser.

MIkroe News

Build multimedia applications simply and quickly using Mikromedia smart display development boards from MIKROE

MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, is unveiling a portfolio of over 100 smart display development boards that enable multimedia applications to be built simply and quickly.

Pickering News

Pickering Interfaces significantly increases RF switching density with new 300 MHz 32x8 PXI & PXIe modules

Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for electronic test and verification, has introduced new integrated PXI RF matrix modules with a 32x8 topology — representing a 33% increase in matrix density per chassis slot. Compact 4x-724 family enables scalability of high-performance RF switching systems and reduces test cycle duration.

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