Murata has entered into a technology partnership with antenna manufacturer Ignion. This will see Murata components used as a foundation for development using Ignion’s Antenna Intelligence Cloud.
Flex Power Modules has added to its PKU-D series of low-profile sixteenth-brick DC-DC converters with the PKU3913D, a 100 W rated part with an extended input range down to 30 V and regulated output of 12 V/8.3 A.
SK hynix and Solidigm jointly introduced their first collaborative product, a new enterprise solid-state drive (eSSD), P5530. This limited release product highlights the emerging partnership between SK hynix and Solidigm, which formed three months ago when SK hynix acquired Intel’s NAND and SSD business.
ComAp announces a new generation of its bestselling paralleling gen-set controller, InteliGen4 200. This successor to the InteliGen 200 keeps all the InteliGen 200‘s key features but enhances them focusing on three key areas: cyber security, remote communication, and additional flexibility and efficiency for application design.
Through the release of a further three new power management ICs (PMICs), e-peas is providing product developers with even greater scope to implement their energy harvesting systems.
Comprehensive Solutions Feature Celeno’s Industry-Leading Wi-Fi 6 and 6E Chipsets Combined with Renesas Embedded Processing, Power, Timing and Analog Offerings.
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces a new resource site dedicated to its engaging podcast episodes. The site features all episodes from the Empowering Innovation Together podcast series, The Tech Between Us, and will serve as a central hub for all future podcast episodes produced by Mouser.
MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, is unveiling a portfolio of over 100 smart display development boards that enable multimedia applications to be built simply and quickly.
Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for electronic test and verification, has introduced new integrated PXI RF matrix modules with a 32x8 topology — representing a 33% increase in matrix density per chassis slot. Compact 4x-724 family enables scalability of high-performance RF switching systems and reduces test cycle duration.