01
'22
Written on
Copper Mountain Technologies News
01
'22
Written on
PCI-SIG News
PCI-SIG® Announces PCI Express® 7.0 Specification to Reach 128 GT/s
The upcoming PCI Express specification is targeted for release in 2025.
01
'22
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KEMET News
KEMET Introduces 1,000 V AC/DC AEC-Q200 Common Mode Choke Solution for EMI Suppression in Harsh Environments
With a nanocrystalline metal core, SCF-XV achieves higher inductance and impedance values, a broader frequency response, and a smaller footprint than other common mode chokes currently available.
01
'22
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Mouser News
Mouser Electronics Receives TDK’s Top Global, Europe, North America Distribution Awards
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, is proud to announce that it has received three top distribution awards from TDK.
30
'22
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Congatec News
AN ADVANCE INTO THE WORLD OF MIXED-CRITICAL REAL-TIME SERVERS
Congatec – a leading vendor of embedded and edge computing technology – extends its Intel Xeon D-2700 processor based Server-on-Module portfolio by launching five new modules in the compact (160x160mm) COM-HPC Server Size D performance class.
30
'22
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TDK News
Compact 250W 2 x 4 inch medical and industrial power supplies can be conduction or convection cooled
TDK Corporation announces the introduction of the 250W rated TDK-Lambda brand 2” x 4” footprint CUS250M series of AC-DC power supplies.
30
'22
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Hitachi News
Hitachi High-Tech Launches the AFM100 Pro High-Sensitivity Scanning Probe Microscope System with Improved Detection Sensitivity
Pursuing improved sensitivity when measuring physical properties and measurement at atomic and molecular scales.
30
'22
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Intel News
Intel Foundry Services Forms Alliance to Enable Design in the Cloud
IFS Cloud Alliance harnesses the power of massive compute scalability to improve chip design efficiency and accelerate time-to-market for foundry customers.
30
'22
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ST News
STMicroelectronics releases next-generation Bluetooth® system-on-chip, enhanced with latest positioning capabilities
STMicroelectronics has introduced its third-generation Bluetooth® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.
29
'22
Written on
ANSYS News
