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Case studies

Delta Powers Europe’s Largest Solar Park with 3,500 High-Efficiency Inverters

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25  '21
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OSRAM News

T4T-P 4.2.1 comes with new features and a higher NFC programming speed

The Tuner4TRONIC (T4T) software suite makes it really easy for luminaire manufacturers to speed up their production process: OSRAM drivers can be programmed via DALI and/or NFC – reliably, cost-efficiently and in no time at all. And the latest release – T4T Production 4.2.1 – now comes with numerous additional benefits.

25  '21
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Infineon News

Infineon enables highly integrated USB Type-C charger unification

Using energy responsibly is the essential factor for innovations in the field of energy efficiency towards a greener planet. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the market leader for power semiconductors, is continuously investing and innovating in futureproof semiconductor technologies and solutions, enabling environmentally friendly applications as well as performance and ease of design.

22  '21
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Leuze

Quick-action integration via IO-Link

New MD7 system from Leuze makes automation easier: IO-Link master, hubs and sensors enable high-performance systems to be implemented in the smart factory

22  '21
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ARROW News

Arrow Electronics recognised in Bourns’ annual distributor awards

Team and individual performances rewarded for EMEA activity. Arrow Electronics has been recognised both for team and individual performances by Bourns in its annual distribution partner awards.

22  '21
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Mitsubishi Electric News

Mitsubishi Electric to Ship Samples of Wider-temperature-range CWDM 100Gbps (53Gbaud PAM4) EML Chip for Data Centers

Will reduce power consumption and costs of 400 Gbps optical transceivers for data centers. Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of its 100Gbps (53Gbaud) four-level pulse-amplitude modulation (PAM4) electro-absorption modulator (EML) laser diode chip for coarse wavelength division multiplexing (CWDM) on November 1.

22  '21
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TE Connectivity News

TE Connectivity launches first-to-market SolderSleeve device for space

The new solution supports space applications requiring low outgassing and resistance to extreme temperatures. TE Connectivity (TE), a world leader in connectivity and sensors, is introducing its SolderSleeve device for space, a first-to-market solution that provides a controlled and reliable solder joint for low outgassing applications, including low earth orbit (LEO) satellites.

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