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'21
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Baslerweb News
22
'21
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Power Integrations News
Power Integrations Introduces the InnoSwitch3-PD Family of Flyback Switcher ICs with Built-in USB PD Controller
A fully integrated charger solution combines USB PD, PPS, PowiGaN and FluxLink to maximize efficiency and slash component count in adapters and chargers.
22
'21
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Sivers Semiconductors News
Sivers Semiconductors launches new state-of-art 5G NR mmWave RFICs and very high-powered RF modules
Sivers Semiconductors AB today announced the launch of the new highly integrated, state-of-art 5G NR Radio Frequency Integrated Circuits (RFICs), TRB02801 and TRB03901, together with very high-powered RFIC and antenna RF modules, BFM02801 and BFM03901, covering all licensed 5G mmWave bands.
22
'21
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OSRAM News
The latest in ICUTRONIC for high-quality lighting solutions
Electronic Control Gears.
22
'21
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Texas Instruments News
TI brings the power of GaN technology to Delta Electronics' energy-efficient server power supplies for data centers
Industry-leading power density, new architectures and integration can reduce total cost of ownership, helping engineers solve enterprise-server design challenges.
22
'21
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Toshiba News
Toshiba’s New Simulation Technology for Model-Based Development Shortens Verification Times for Automotive Semiconductors by about 90 Percent
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has developed a model-based development (MBD) simulation technology that shortens verification times for automotive semiconductors by about 90 percent.
22
'21
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Keysight technologies News
Keysight and Orolia Advance 5G Location-Based Services Based on Global Navigation Satellite System Technologies
Integrated solutions address global navigation satellite system test requirements defined by 3GPP and major US carriers.
21
'21
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Cadence News
Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon
Samsung and Cadence co-develop Mixed-Signal OpenAccess-ready PDKs that enable seamless implementation and verification of mixed-signal designs for data centers, networking, 5G, mobile, industrial and automotive applications.
21
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Melexis News
Melexis and emotion3D combine DMS and HUD dynamic object alignment in a single camera
Melexis, a global leader in automotive semiconductors, and emotion3D, a leading provider of camera-based automotive in-cabin analysis software, have joined forces to offer a unique 3D Time-of-Flight (ToF) demonstrator. The solution combines the driver monitoring system (DMS) with high-precision 3D driver localization, to dynamically align augmented reality head-up displays (AR HUD) objects.
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Wenglor News
