Freedom with New RF mmWave 5G25 Connector Series. Molex, a global electronics leader and connectivity innovator, today introduced the Molex Flex-to-Board RF mmWave Connector 5G25 series to meet demanding 5G mmWave applications requiring stringent signal integrity at higher frequencies up to 25 GHz.
Anritsu Corporation is pleased to announce that the first Release 16 Minimization of Drive Test (MDT) Protocol Conformance Test for 5G New Radio (NR) Standalone (SA) has been verified on the 5G NR Mobile Device Test Platform ME7834NR powered by the Snapdragon® X65 5G Modem-RF System, the world’s first Release 16 modem-RF system.
The VN9D30Q100F and VN9D5D20FN from STMicroelectronics introduce a new generation of automotive intelligent switches, the first in the market with digital current sensing among the fully digital on-chip diagnostic features.
Hexagon’s Geosystems division announced today the introduction of the Leica ContentMapper, an innovative and highly efficient airborne imaging sensor for large-scale geospatial mapping projects. With a 40,000 pixels swath width, this latest generation camera provides the highest performance for content programs, capturing high resolution imagery at unprecedented rates.
TDK Corporation (TSE:6762) today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.
STMicroelectronics has announced new STM32Cube software packs and tools, as well as evaluation boards, to accelerate development with the latest STM32U5 microcontrollers (MCUs), which are now ready for mass-market applications with stock at authorized distributors.
The safe analog input module SAI 041 expands the modular S-DIAS Safety System. Four analog current inputs with a measurement range from 4-20 mA and a resolution of 16 bits, as well as the 24 V sensor supply are integrated into the 25 mm wide DIN rail module.
Sivers Semiconductors AB announces today the participation at SPIE Photonex + Vacuum Technologies in Glasgow, UK. The subsidiary, Sivers Photonics, will exhibit and speak at the event taking place from 28 – 30 September.