16
'21
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SK Hynix News
16
'21
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Inelta News
Replaceable at full process pressure: New LVDT valve sensors with a modular design
With their special modular construction, the LVDT-based valve sensors in the IHDL-M16 series from Inelta Sensorsysteme allow the sensor module to be replaced while the process is running.
15
'21
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Acceed News
Slim industry switch with 8 RJ45 + 2 SFP
A switch must always be affordable and easy to install if high port density is required in extended industrial centres. Robust design for the highest possible permissible ambient temperatures during operation is a further factor in favour of enabling rail mounting and the installation of several switches in switch boxes.
15
'21
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Moxa
Moxa Demonstrates Game-changing Solution for Next-level Time-sensitive Networking
Joint Collaboration Between Moxa, Intel, and port industrial automation GmbH to Advance Deterministic Network Communication Over Standard Ethernet.
15
'21
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innodisk
Innodisk Releases the World’s First 10GbE LAN Module in M.2 Form Factor
Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility
15
'21
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Renesas News
Renesas Develops Write Technologies for Embedded STT-MRAM Significantly Reducing MCUs Power Consumption in IoT Applications
Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip.
15
'21
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Omniflex News
All-in-one solutions help deliver ongoing operational efficiency
Why industry should look to fully integrated all-in-one monitoring and control systems.
15
'21
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iSYSTEM News
Risk-free debugging with iSYSTEM Galvanic Isolation Adapters
Preventing personal injury and electrical damage to both development equipment and target.
15
'21
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Infineon News
Infineon expands wireless portfolio to support Matter with multiprotocol solutions including Bluetooth LE and 802.15.4 low-power SoC for smart homes
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC Bluetooth® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market.
15
'21
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Renesas News
