20
'21
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Silicon Labs News
20
'21
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Cadence News
Cadence Collaborates with GlobalFoundries to Qualify Pegasus Verification System for 12LP/12LP+ and 22FDX Technologies
Pegasus Verification System qualification enables customers to confidently perform physical verification for hyperscale, aerospace 5G communications, consumer and automotive designs.
20
'21
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Leuze
The sensor expert Leuze is growing
Despite the coronavirus pandemic and the decline in plant and mechanical engineering, 2020 was a successful business year for Leuze
20
'21
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CONTA-CLIP News
Tool-less round cable entries for cables with plugs
Conta-Clip completes its KDS-R modular cable entry program for round metric breakouts from M20 to M63, adding small-diameter versions for cables and conduits with cross-sections from 2 mm to 35 mm.
20
'21
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RAFI News
E²MS for low-power applications
Today, the energy consumption of heating radiators is usually recorded and calculated fully automatically using smart meters.
20
'21
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TEKTRONIX News
Tektronix Introduces S530 Parametric Test System with KTE V7.1 Software to Speed Semiconductor Chip Production
Tektronix, Inc., a leading worldwide provider of test and measurement solutions, today released KTE V7.1 software for the Keithley S530 Series Parametric Test System to help accelerate semiconductor chip manufacturing just when the world market needs it most.
20
'21
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Sivers Semiconductors News
Sivers Semiconductors’ Japanese lead customer takes important step towards mass production
Sivers Semiconductors AB today announces that its Japanese lead customer Fujikura, after several successful customer trials, is now preparing the start of full-scale, high-quality volume production of their 60 GHz communication module.
20
'21
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Acceed News
Rack PC with Nvidia GPUs and M12 connections
The now newly announced industrial Box PC SEMIL-1300GC from Acceed convinces with a clever extension concept.
20
'21
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Infineon News
Infineon opens high-tech chip factory for power electronics on 300-millimeter thin wafers
Infineon Technologies AG today officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria under the motto “Ready for Mission Future.”
20
'21
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VIA Tech News
