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Microchip News

Microchip to Provide Silicon Carbide MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design

Electric vehicle, commercial transportation, renewable energy and storage system designers can benefit from silicon carbide stack solution that drives performance and cost efficiencies and accelerates time to market by up to six months.

Inelta News

The smallest LVDT with probe function in the world – from Inelta

Inelta is expanding its range of miniaturized displacement sensors for medical, laboratory and testing technology with the world’s smallest LVDT with a probe function: the LVDT of the IFAT series has an outer diameter of only 6 mm and is designed for the highly accurate detection of measurement ranges between 2.5 mm and 10 mm.

Sivers Semiconductors News

Sivers Semiconductors delivers proof point of its world leading 5G mmWave technology in collaboration with Rohde & Schwarz

Sivers Semiconductors AB today announced that its subsidiary Sivers Wireless has partnered with Rohde & Schwarz, a market-leading supplier of test and measurement solutions for Radio Frequency (RF) components and the wireless industry, to test the performance of Sivers Semiconductors state-of-art Radio Frequency Integrated Circuit (RFIC) TRXBF01.

TDK News

THERMISTORS: TDK OFFERS HIGH-PRECISION NTC CHIPS FOR EMBEDDING INTO IGBT MODULES

TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of -55 °C to +175 °C, has dimensions of 1.6 x 1.6 x 0.5 mm.

Mouser News

Mouser Electronics Now Distributing Fujitsu Semiconductor Memory Solution Products

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, proudly announces that it now distributes ferroelectric random access memory (FRAM) and large-density resistive random access memory (ReRAM) products from Fujitsu Semiconductor Memory Solution.

Fraunhofer News

MEMS MICROSPEAKERS FOR THE FUTURE OF THE MOBILE INTERNET

The microspeakers for wireless in-ear headphones from Arioso Systems GmbH, a spin-off of the Fraunhofer Institute for Photonic Microsystems IPMS, are up to ten times smaller than conventional microspeakers and are made entirely from silicon. Currently at the prototype stage, the energy-efficient MEMS speakers may in future play a role in expanding the range of functions offered by miniaturized headphones – such as instant translations and health monitoring features. This is made possible by an innovative sound transducer principle that dispenses with the membrane, the central element of a conventional speaker.

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