03
'21
Written on
Rohm Semiconductors News
03
'21
Written on
TTI News
TTI Showcases Latest Developments in Powertrain Technology at EHVT 2021
Cutting-edge xEV technologies from TTI’s valued manufacturing partners.
03
'21
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Micron News
Micron’s New Crucial DDR5 Memory Delivers Blazing Speeds and Massive Bandwidth to Consumers for Next-Gen Desktop PCs
Providing up to 50% higher data transfer speeds at 4800MT/s, Micron’s Crucial DDR5 memory also nearly doubles effective bandwidth over DDR4 memory right out of the box.
03
'21
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Anritsu News
Upgraded MP1900A PCI Express® 5.0 Receiver and USB 3.2 x2-Lane Tests
Anritsu Corporation is pleased to announce the sales launch of its Signal Quality Analyzer-R MP1900A series with upgraded PCI Express® 5.0 Receiver and USB 3.2 x2-lane Test functions.
03
'21
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Intel News
Intel Powers New Amazon EC2 C6i Instances
AWS uses 3rd Gen Intel Xeon Scalable processors in its new EC2 C6i instances for compute-intensive workloads.
03
'21
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ANSYS News
Ansys and Honeywell Accelerate Safety-critical Software Development
Technology collaboration ensures safety-critical systems for aerospace, automotive and other industries are automatically validated, secure and reliable.
03
'21
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Keysight technologies News
Keysight First to Gain GCF Approval for 5G Protocol Conformance Test Cases Based On 3GPP Release 16 Specifications
Accelerates validation of self-organizing networks and the minimization of drive testing features.
03
'21
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Ceramtec News
Manufacturing of SiSiC plates for semiconductor machines with a focus on process integration
With manufacturing processes in the semiconductor industry becoming increasingly more demanding, component suppliers must offer products of the highest quality to meet current and future demands in chip production. Focussing on both product innovation and process integration, globally leading advanced ceramics manufacturer CeramTec applies a two-fold approach to enable higher chip quality.
03
'21
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Diodes Incorporated News
Complete Ultra-High-Power-Density Charger Solution from Diodes Incorporated Delivers Improved Efficiency and Reduced Size
Diodes Incorporated (Nasdaq: DIOD) has launched a three-chip solution for enhancing the performance of ultra-high-power-density USB Type-C® power delivery (PD) systems. These products can be used in a wide variety of consumer electronics applications, including smartphone chargers and notebook adapters.
03
'21
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Wenglor News
