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Leuze

Quick-action integration via IO-Link

New MD7 system from Leuze makes automation easier: IO-Link master, hubs and sensors enable high-performance systems to be implemented in the smart factory

Mitsubishi Electric News

Mitsubishi Electric to Ship Samples of Wider-temperature-range CWDM 100Gbps (53Gbaud PAM4) EML Chip for Data Centers

Will reduce power consumption and costs of 400 Gbps optical transceivers for data centers. Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of its 100Gbps (53Gbaud) four-level pulse-amplitude modulation (PAM4) electro-absorption modulator (EML) laser diode chip for coarse wavelength division multiplexing (CWDM) on November 1.

TE Connectivity News

TE Connectivity launches first-to-market SolderSleeve device for space

The new solution supports space applications requiring low outgassing and resistance to extreme temperatures. TE Connectivity (TE), a world leader in connectivity and sensors, is introducing its SolderSleeve device for space, a first-to-market solution that provides a controlled and reliable solder joint for low outgassing applications, including low earth orbit (LEO) satellites.

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