19
'21
Written on
Melexis News
19
'21
Written on
Sigmatek News
WIRELESS ROAMING FEATURE: MORE RANGE FOR WIRELESS OPERATION
To enable system operators to move even more freely along the production line, SIGMATEK has developed the “Wireless Roaming Feature” for wireless HMIs.
19
'21
Written on
Moxa
Advancing industrial digital transformation with Moxa know-how
Moxa at SPS on Air 2021 – Digital and On-demand.
19
'21
Written on
Sps Mesago News
SPS 2021 is canceled
Following the announcement made by Bavarian Prime Minister Dr. Markus Söder in today's press conference, Mesago Messe Frankfurt GmbH is canceling the SPS - Smart Production Solutions, which was scheduled to take place in Nuremberg from 23 - 25 November 2021.
19
'21
Written on
Rohm Semiconductors News
ROHM Recognized as a Preferred Supplier of SiC Power Solutions by UAES
ROHM has recently been certified as a preferred supplier of SiC power solutions by United Automotive Electronic Systems Co., Ltd., (UAES), a Chinese Tier 1 comprehensive automotive manufacturer.
19
'21
Written on
Toshiba News
Toshiba Releases Its First 200V Transistor Output Automotive Photocoupler
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched a high voltage transistor output automotive photocoupler, “TLX9188,” for isolated signal communication in automotive equipment, including electric mobility vehicles. Volume shipments start today.
19
'21
Written on
Infineon News
Infineon joins the Connectivity Standards Alliance Board of Directors
The Connectivity Standards Alliance (CSA), an organization with over 400 companies working together to simplify and harmonize the Internet of Things (IoT) through technology standards, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a world leader in semiconductor solutions, today announced Infineon will be joining the Alliance’s Board of Directors as a Promoter Member.
18
'21
Written on
ANSYS News
Ansys Multiphysics Solutions Achieve Certification for Samsung’s 3nm and 4nm Process Technologies
Ansys’ collaboration with Samsung Foundry delivers industry-leading power integrity and electromigration signoff solutions for low-power mobile and high-performance computing applications.
18
'21
Written on
Diamond News
Low-maintenance Lensed Interconnects designed to withstand adverse conditions
The Challenge: Harsh environment applications require rugged and reliable components able to withstand adverse conditions that standard commercial connectors and cable assemblies typically cannot endure. Connector contaminants are the leading cause of power loss and signal degradation, often requiring the continuous need for cleaning.
18
'21
Written on
IAR Systems News
