The STMicroelectronics TCPP03-M20 USB Type-C port-protection IC is tailored for Dual-Role Power (DRP) applications, simplifying the design of products that can act as a power source for connected devices as well as accepting power from other USB-C sources.
ACTIA continues to structure the Power division, enhancing the clarity of its vehicle electrification businesses. This division consolidates the various activities of the ACTIA group relating to the design and manufacture of on-board batteries, power electronics and electrification systems for electric and hydrogen hybrid mobility.
New from Omron Electronic Components Europe is the G5RL-K-EL latching relay tailored for the high inrush performance needed in smart building automation systems and for the control of capacitive loads.
Building on a longstanding relationship, Ansys (NASDAQ: ANSS) today announced a multiyear agreement with Seagate Technology to expand Seagate’s use of Ansys’ simulation solutions worldwide.
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned.
Future-oriented key technologies in microelectronics and microsystems technology (MST) will be presented at the MST Congress in Ludwigsburg from November 8 to 10, 2021. The Fraunhofer Institute for Photonic Microsystems IPMS will participate at the joint booth of the Research Fab Microelectronics Germany (FMD). In numerous lectures and poster sessions, the institute will present current results and developments from the fields of intelligent MEMS-based sensor and actuator technology for applications in medical technology, chemical analytics and Industry 4.0.
Key aspects of the 5G-based Future Railway Mobile Communication System (FRMCS) have been investigated within four research projects by Digitale Schiene Deutschland together with major industry partners like Kontron Transportation. The insights are paying into an FRMCS design that efficiently serves the needs of the digital railway system.