NH series linear guides from NSK are helping a manufacturer of motion platforms for semiconductor manufacturing to provide its customers with a solution that offers speed and precision beyond previous capabilities. Called TELICA, this technology-driven breakthrough from Switzerland-based ETEL S.A. - a specialist in the design and manufacture of motion systems for semiconductors - can benefit any application in this sector that requires a combination of high throughput and high accuracy.
Panasonic’s innovative optical sensor accurately detects particles as small as 0.3µm, improving surrounding air quality by the smart activation of air purification equipment.
Intel today launched its newest 3rd Gen Intel® Xeon® Scalable processor (code-named “Ice Lake”), including new network-optimized “N-SKUs” along with verified solution blueprints that accelerate time to market.
Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).
Home to one of the nation’s first cross-industry 5G testbeds on it research campus in Upstate New York, GE Research, the technology development arm of the General Electric Company (GE), officially launched two projects as part of the U.S. Department of Defense’s (DOD) recently announced $600 million 5G initiative.
FN980 is ideal for bandwidth-intensive enterprise applications and enables original equipment manufacturers (OEMs) to quickly leverage AT&T’s 5G nationwide network.
After a successful integration of DECTRIS ELA® detector into Gatan’s DigitalMicrograph® software and introduction of the Stela camera to their portfolio, the EM manufacture from California is now announcing the DECTRIS-powered hybrid-pixel camera as a low-voltage partner to the Gatan’s GIF Continuum® K3® product line to enable advanced EELS and 4D STEM over the full energy range of today's S/TEM.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy.
RivieraWaves Bluetooth Dual Mode 5.2 IP proving extremely popular with semiconductors and OEMs developing wireless audio ICs, with more than fifteen licensees to date.