In the presence of Thierry Le Hénaff, Chairman and CEO of the Group, Arkema today inaugurates the Christian Collette Center of Excellence dedicated to batteries at its Pierre-Bénite Research Center. On this occasion the Group will announce a 50% increase in its Kynar® PVDF fluoropolymer production capacities at its Pierre-Bénite site in order to address the fast-growing demand for materials for lithium-ion batteries. Arkema now aims for sales of at least one billion euros in batteries by 2030.
MLX81118 with 24 outputs enhances flexibility to animate and personalize ambient lighting via LIN, delivering increased reliability and ISO 26262 compliance for ASIL-A applications.
To enable system operators to move even more freely along the production line, SIGMATEK has developed the “Wireless Roaming Feature” for wireless HMIs.
Following the announcement made by Bavarian Prime Minister Dr. Markus Söder in today's press conference, Mesago Messe Frankfurt GmbH is canceling the SPS - Smart Production Solutions, which was scheduled to take place in Nuremberg from 23 - 25 November 2021.
ROHM has recently been certified as a preferred supplier of SiC power solutions by United Automotive Electronic Systems Co., Ltd., (UAES), a Chinese Tier 1 comprehensive automotive manufacturer.
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched a high voltage transistor output automotive photocoupler, “TLX9188,” for isolated signal communication in automotive equipment, including electric mobility vehicles. Volume shipments start today.
The Connectivity Standards Alliance (CSA), an organization with over 400 companies working together to simplify and harmonize the Internet of Things (IoT) through technology standards, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a world leader in semiconductor solutions, today announced Infineon will be joining the Alliance’s Board of Directors as a Promoter Member.
Ansys’ collaboration with Samsung Foundry delivers industry-leading power integrity and electromigration signoff solutions for low-power mobile and high-performance computing applications.
The Challenge: Harsh environment applications require rugged and reliable components able to withstand adverse conditions that standard commercial connectors and cable assemblies typically cannot endure. Connector contaminants are the leading cause of power loss and signal degradation, often requiring the continuous need for cleaning.