NXP Semiconductors (NASDAQ: NXPI) today announced the i.MX 93 family of applications processors designed for automotive, smart home, smart building and smart factory applications, which leverage edge machine learning to anticipate and automate based on user needs.
Third-Generation Beamformer ICs Enable High-Efficiency and Low-Cost Phased Array Radios with Extended Signal Range, Unlocking Enhanced Performance for 5G Wireless and Fixed Wireless Access.
Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, today released “Supply Chain Transformed,” a new video series that follows the journey of components across the supply chain as they are integrated and incorporated into next-generation asset monitoring and tracking systems.
New KIOXIA CD7 E3.S Series EDSFF E3.S Data Center SSDs Optimized for Density and Efficiency. KIOXIA Europe GmbH announced today the industry’s first line-up of Enterprise and Data Center Standard Form Factor (EDSFF) E3.S SSDs designed with PCIe® 5.0 technology[1].
Embedded MXM graphics modules offer high performance, power-efficient GPU computing to accelerate time-sensitive and mission-critical industrial applications at the edge.
Vector now presents the VN5611 and N5612 hardware, both compact and handy interfaces for Automotive Ethernet applications. Users benefit from flexible configuration and usage options in the Ethernet environment. Advantages such as Ethernet Monitoring and individual access options to the network under test are characteristic for both devices.
ams OSRAM (SIX: AMS), a global leader in optical solutions, participated in the 2021 AspenCore Double Summits (2021 Global CEO Summit and the 2021 Global Distribution & Supply Chain Leader Summit) in Shenzhen, which was hosted by ASPENCORE, a well-known leading electronics industry-focused media group.