While 5G technology is undoubtedly improving global connectivity capabilities, it has led to challenges for telecoms equipment manufacturers because of the demands imposed by its operation.For example, the frequencies used with 5G raise to much higher than with 4G and those signals cannot easily penetrate some materials and can be easily obstructed, which has led to signal attenuation issues.
Toshiba Electronics Europe GmbH (“Toshiba”) has launched a new normally open (NO) 1-Form-A photorelay that is intended for use in a multitude of battery- and hybrid-electric vehicle applications including within the battery management system (BMS), ground fault detection and identifying faults with mechanical relays.
Combined solution enables RISC-V developers to develop and deploy robust and reliable software meeting automotive and industrial safety certifications.
The Swiss-headquartered Fischer Connectors Group continues to push the boundaries of high-density miniaturization in connectivity. Its ultra-miniature, rugged series of connectors, cable assemblies and electronic solutions has been extended to help engineers add more functionality and meet high-speed data acquisition and transmission requirements in applications with extreme limitations in space, even in harsh operating environments.
It has become the flagship series of “super-low ESR”: Panasonic Industry’s SP-Cap portfolio of Aluminum Polymer capacitors are the ideal choice wherever a low ESR would be the primary consideration for identifying the most suitable capacitor. Proven technology, triple increase in lifetime and ready for the heat
2.4 GHz wireless SoCs improve AI/ML performance by 4x using 1/6th the energy.New AI/ML Software Toolkit Optimizes TensorFlow for all Silicon Labs SoCs.