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Phoenix Contact News

New I/Os for field installation

Phoenix Contact is extending its portfolio of I/O systems for control- cabinet-free automation with the new generation of the Axioline E I/O system.

Infineon News

Infineon and MCI supply sensors for air quality measurement to schools in Carinthia and Tyrol

Five Higher Technical Schools (Höhere Technische Lehranstalten, HTLs) in Carinthia and six in Tyrol received high-precision CO 2 sensors from Infineon Technologies Austria AG and MCI in Innsbruck. The teams of students will use them to build CO 2 alarm lights to indicate the necessity for ventilation thus reducing the risk of infection. A total of 300 classrooms will be equipped.

Rohm Semiconductors News

ROHM’S NEW 13.56MHZ WIRELESS POWER SUPPLY CHIPSET UP TO 1W

ROHM Group company LAPIS Technology developed a chipset capable of providing up to 1W of wireless power for compact and streamlined wearable devices, and for industrial smart, miniaturized and sealed solution. The ML7661 (transmitter) and ML7660 (receiver) eliminate the need for an external MCU by incorporating a control circuit required for transmission/reception, resulting in the industry’s smallest system size in the 1W class. This makes it ideal for wearables with a large battery capacity designed to be worn for long time frames. Typical products are wristband blood pressure monitors, fitness trackers, smart watches, and hearing aids, for example. Moreover, the adoption of the high 13.56MHz frequency band enables the support for Near Field Communication (NFC).

TDK News

THERMISTORS: TDK OFFERS HIGH-PRECISION NTC CHIPS FOR EMBEDDING INTO IGBT MODULES

TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of -55 °C to +175 °C, has dimensions of 1.6 x 1.6 x 0.5 mm.

Sivers Semiconductors News

Sivers Semiconductors delivers proof point of its world leading 5G mmWave technology in collaboration with Rohde & Schwarz

Sivers Semiconductors AB today announced that its subsidiary Sivers Wireless has partnered with Rohde & Schwarz, a market-leading supplier of test and measurement solutions for Radio Frequency (RF) components and the wireless industry, to test the performance of Sivers Semiconductors state-of-art Radio Frequency Integrated Circuit (RFIC) TRXBF01.

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