Microchip's new GNSS Disciplined Oscillator Modules make it simple to integrate Position, Navigation and Timing (PNT) technology into a wide range of applications.
Toshiba and SICC have signed an MOU to improve the quality and characteristics of SiC power semiconductor wafers, ensuring a stable supply for the growing demand in AI data centers.
New MCU family complies with CNSA 2.0 and PSA Level 3, enabling secure motor control and power conversion applications while easing the industry’s transition to the PQC era.
Keysight’s solution supports 8K/12K video, HDR, and high-speed HDMI, offering automated compliance, diagnostics, and certification readiness for transmitters and cables.
Broadcom and NVIDIA are collaborating to integrate NVIDIA Blackwell architecture into VMware Cloud Foundation, enabling enterprises to build and deploy next-generation AI models in their private clouds.
IBM and AMD plan hybrid systems integrating quantum computers with HPC, targeting fault-tolerant qubits and exascale-class AI workflows by decade’s end.