05 {{ "2024-09-05T00:00:00+00:00" | date "MMM" }} '24

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TDK News

TDK expands compact high-current choke series ERU33 toward higher currents with new core material

TDK Corporation expanded the EPCOS ERU33 high-current chokes with the even higher-current ERU33M using a new core material, that exhibits a softer saturation characteristic than the core material used previously.

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05 {{ "2024-09-05T00:00:00+00:00" | date "MMM" }} '24

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Navitas News

Navitas Qualifies Leading-edge Gen-3 Fast SiC to Auto-grade (Q101)

Next-gen silicon carbide (SiC) power semis drive innovation in 400 and 800 V EV architectures.

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05 {{ "2024-09-05T00:00:00+00:00" | date "MMM" }} '24

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Eggtronic News

Eggtronic Announces Evaluation Board for Ultra-Compact, Ultra-High-Efficiency 240W PD 3.1 Charger

Unique SmartEgg single-stage PFC and isolated regulation architecture delivers over 95% peak efficiency with minimum BOM.

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05 {{ "2024-09-05T00:00:00+00:00" | date "MMM" }} '24

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Nordic Semiconductor News

Bluetooth 6.0 Channel Sounding supported by Nordic Semiconductor’s upcoming nRF54 Series SoCs

With the Bluetooth SIG’s adoption of Channel Sounding as part of Bluetooth 6.0, Nordic is implementing the technology in its soon-to-be-released nRF54 Series.

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05 {{ "2024-09-05T00:00:00+00:00" | date "MMM" }} '24

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Vector News

New Vector Network Interface Supports Next-Generation Automotive CAN XL Networks

Vector introduces the VN1641 Network Interface for next-generation automotive CAN XL networks.

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05 {{ "2024-09-05T00:00:00+00:00" | date "MMM" }} '24

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Kuka News

Discover new KR SCARA robots from KUKA for wide range of industries

Four-axis robots handle 60 kg payload and can reach of up to 1.2 meters, suitable for multiple electronic applications.

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05 {{ "2024-09-05T00:00:00+00:00" | date "MMM" }} '24

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Yamaha Motor News

Yamaha Robotics to present advanced inspection solutions powering emerging trends at Electronica 2024

Opportunity to see innovations in 3D-AOI that increase resolution, throughput, and accuracy, the latest in solder-paste inspection (SPI), and new software tools in YSUP production support package.

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04 {{ "2024-09-04T00:00:00+00:00" | date "MMM" }} '24

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innodisk

Innodisk Unveils Advanced CXL Memory Module to Power AI Servers

Innodisk launched its cutting-edge Compute Express Link (CXL) Memory Module, which is designed to meet the rapid growth demands of AI servers and cloud data centers.

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04 {{ "2024-09-04T00:00:00+00:00" | date "MMM" }} '24

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ViewSonic

ViewSonic Launches High-Brightness Laser Projector Series with Up to 8,500 ANSI Lumens for Large Venues

ViewSonic Corp., a leading global provider of visual solutions, expands its Luminous Superior Series by launching high-brightness laser B2B projectors. With brightness levels reaching up to 8,500 ANSI Lumens, these projectors deliver exceptional visual experiences in large venues such as auditoriums, museums, and reception areas.

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04 {{ "2024-09-04T00:00:00+00:00" | date "MMM" }} '24

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Vishay News

New Vishay Intertechnology Silicon PIN Photodiode Improves Sensitivity in Biomedical Applications

Key Features Include Larger Sensitive Area of 6.0 mm², Increased Reverse Light Current, and Small Form Factor of 4.8 mm by 2.5 mm by 0.5 mm.

Read more…

TDK Corporation expanded the EPCOS ERU33 high-current chokes with the even higher-current ERU33M using a new core material, that exhibits a softer saturation characteristic than the core material used previously.

Next-gen silicon carbide (SiC) power semis drive innovation in 400 and 800 V EV architectures.

Unique SmartEgg single-stage PFC and isolated regulation architecture delivers over 95% peak efficiency with minimum BOM.

With the Bluetooth SIG’s adoption of Channel Sounding as part of Bluetooth 6.0, Nordic is implementing the technology in its soon-to-be-released nRF54 Series.

Vector introduces the VN1641 Network Interface for next-generation automotive CAN XL networks.

Four-axis robots handle 60 kg payload and can reach of up to 1.2 meters, suitable for multiple electronic applications.

Opportunity to see innovations in 3D-AOI that increase resolution, throughput, and accuracy, the latest in solder-paste inspection (SPI), and new software tools in YSUP production support package.

Innodisk launched its cutting-edge Compute Express Link (CXL) Memory Module, which is designed to meet the rapid growth demands of AI servers and cloud data centers.

Key Features Include Larger Sensitive Area of 6.0 mm², Increased Reverse Light Current, and Small Form Factor of 4.8 mm by 2.5 mm by 0.5 mm.

International