29
'24
Written on
Nexperia News
29
'24
Written on
ASUS News
ASUS Presents Comprehensive AI Server Lineup
World-class expertise unleashes new AI-powered paradigms across diverse industries and applications.
28
'24
Written on
ADNOC News
ADNOC Deploys Pioneering AI-Enabled Process Optimization Technology
Pilot phase results indicate that Neuron 5 could reduce unplanned shutdowns by 50% and increase planned maintenance intervals by 20%.
28
'24
Written on
Nvidia News
NVIDIA and Global Partners Launch NIM Agent Blueprints for Enterprises to Make Their Own AI
Companies Can Build and Operationalize Their AI Applications — Creating Data-Driven AI Flywheels — Using NIM Agent Blueprints Along With NIM Microservices and NeMo Framework, All Part of the NVIDIA AI Enterprise Platform.
28
'24
Written on
ONSEMI News
onsemi Releases Upgraded Power Modules to Boost Solar Power Generation and Energy Storage
Silicon and Silicon Carbide Hybrid solutions reduce footprint while increasing power output by 15%.
28
'24
Written on
Omnivision News
OMNIVISION Introduces 1/2.88-inch Small-Format 50-Megapixel Image Sensor with Video HDR for Mobile Smartphone Cameras
OV50M40 image sensor can be used in multiple smartphone cameras to enable excellent low-light performance, high-quality tele-crop-zoom, always-on ultra-low power applications and more.
27
'24
Written on
ASUS News
ASUS Unveils ROG, TUF Gaming, Prime, ProArt X870E / X870 Motherboards during Gamescom 2024
New motherboards are ready for AMD Ryzen 9000 Series CPUs and loaded with next-gen connectivity, smart features, and performance-boosting refinements.
24
'24
Written on
Samsung News
Samsung announces the availability of HBM4 36GB MTV in November 2024
HBM4 36GB Mechanical Test Vehicle (MTV), for use by OEM customers wanting to prepare for the advanced Samsung HBM4 36GB production devices coming in 2025.
24
'24
Written on
TDK News
TDK extends AEC-Q200 qualified SMD alloy powder choke series ERU27M for rated currents up to 48 A
TDK Corporation has extended its EPCOS ERU27M series of SMD high current flat wire inductors consisting of an isolated alloy powder core and flat wire helical winding.
23
'24
Written on
Nexperia News
