Amphenol's ExaMAX2 backplane connector system supports 112Gb/s PAM4 performance and an 85 ohm nominal impedance version that meets PCIe 6.0 specifications.
The new IPOSIM feature enables realistic modeling of switching behavior, thermal dynamics, and gate driver effects, helping engineers optimize EV, solar, and industrial power designs efficiently.
Rutronik's OSCONIQ P 3737 Batwing LEDs achieve 80.1% efficiency at 660nm with 140° beam profile and 2800mA capacity for horticulture and indoor farming applications.
The new RBE01VYM6AFH diode achieves ultra-low VF below 300mV and IR under 20mA, ensuring reliable, compact, and thermally stable protection for ADAS and industrial cameras.
Melexis’ MLX80124 LIN RGB LED driver delivers code-free configuration, precise color control, and automotive-grade diagnostics for ambient lighting applications.
ASMPT presents SIPLACE platform with 30% productivity gains, hybrid CA2 for advanced packaging, MEGA multi-chip bonder, and intelligent factory software at Productronica 2025.
Rutronik stocks TDK Micronas' HVC 5222D with ARM Cortex-M3, 32 KB flash, LIN transceiver, and AEC-Q100 qualification in compact 5×5mm package for automotive and industrial motors.
The collaboration merges Inova’s ISELED 2.0 smart LED platform with TactoTek’s IMSE in-mold electronics to deliver lightweight, space-efficient, and intelligent 3D lighting structures for automotive applications.