26 {{ "2024-06-26T00:00:00+00:00" | date "MMM" }} '24

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Cadence News

Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity

Cadence Janus NoC enables design teams to achieve better PPA faster and with lower risk, freeing up valuable engineering resources for SoC differentiation.

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26 {{ "2024-06-26T00:00:00+00:00" | date "MMM" }} '24

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NETGEAR News

NETGEAR Introduces New Addition To Industry-Leading WiFi 7 Home Networking Product Lineup

New Nighthawk Router expands NETGEAR’s WiFi 7 portfolio offering incredible value for multi-gig speeds and revolutionary performance.

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26 {{ "2024-06-26T00:00:00+00:00" | date "MMM" }} '24

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Toshiba News

TOSHIBA ANNOUNCES MG10-D SERIES OF ENTERPRISE HDDS WITH CAPACITIES UP TO 10TB

Built for the increasing application demands of enterprise server and storage solutions, the MG10-D Series delivers a new level of performance.

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25 {{ "2024-06-25T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon Expands AIROC Wi-Fi 6/6E Portfolio with CYW5591x MCUs

The new family of devices features long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4, enabling cost-optimized, power-efficient, small form-factor products for smart home, industrial, wearables, and IoT applications.

Read more…

25 {{ "2024-06-25T00:00:00+00:00" | date "MMM" }} '24

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HARTING USA

Bridging Dimensions

How HARTING and Altium Revolutionized 3D-Circuits Design.

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24 {{ "2024-06-24T00:00:00+00:00" | date "MMM" }} '24

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CEA Leti News

CEA-Leti Showcases 3D Integration Advances for More Than Moore & RF Devices at VLSI Conference

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits, highlighting their progress in 3D integration technologies for designing More than Moore systems, particularly RF integrated systems.

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24 {{ "2024-06-24T00:00:00+00:00" | date "MMM" }} '24

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Rutronik Info

Next generation of DC/DC converter from RECOM at Rutronik

Rutronik introduces RECOM's new R24C2T25 series 2 W isolated DC/DC converter, which enable designers to evaluate and use multiple types of SiC power transistors without time-consuming and costly design changes.

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21 {{ "2024-06-21T00:00:00+00:00" | date "MMM" }} '24

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Navitas News

Navitas Drives Lenovo’s Mobile Fast Charger Development

Next-gen GaNFast™ Power ICs Enable Lenovo to Create Efficient, Lightweight, and Sustainable High-Speed GaN Chargers.

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21 {{ "2024-06-21T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon announces availability of its CoolGaN 700 V power transistors for increased performance in consumer and industrial applications

Infineon Technologies AG introduces the new CoolGaN™ Transistor 700 V G4 product family. The devices are highly efficient for power conversion in the voltage range up to 700 V.

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21 {{ "2024-06-21T00:00:00+00:00" | date "MMM" }} '24

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Renesas News

Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software

RoX SDV Platform Combines Hardware, Out-of-Box Software and Cloud-Native AI Development Environment for ADAS, IVI and Gateway Systems.

Read more…

Cadence Janus NoC enables design teams to achieve better PPA faster and with lower risk, freeing up valuable engineering resources for SoC differentiation.

New Nighthawk Router expands NETGEAR’s WiFi 7 portfolio offering incredible value for multi-gig speeds and revolutionary performance.

Built for the increasing application demands of enterprise server and storage solutions, the MG10-D Series delivers a new level of performance.

The new family of devices features long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4, enabling cost-optimized, power-efficient, small form-factor products for smart home, industrial, wearables, and IoT applications.

How HARTING and Altium Revolutionized 3D-Circuits Design.

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits, highlighting their progress in 3D integration technologies for designing More than Moore systems, particularly RF integrated systems.

Rutronik introduces RECOM's new R24C2T25 series 2 W isolated DC/DC converter, which enable designers to evaluate and use multiple types of SiC power transistors without time-consuming and costly design changes.

Next-gen GaNFast™ Power ICs Enable Lenovo to Create Efficient, Lightweight, and Sustainable High-Speed GaN Chargers.

Infineon Technologies AG introduces the new CoolGaN™ Transistor 700 V G4 product family. The devices are highly efficient for power conversion in the voltage range up to 700 V.

RoX SDV Platform Combines Hardware, Out-of-Box Software and Cloud-Native AI Development Environment for ADAS, IVI and Gateway Systems.

International