18
'21
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Keysight technologies News
18
'21
Written on
Cadence News
New Cadence Tensilica FloatingPoint DSP Family Delivers Scalable Performance for a Broad Range of Compute-Intensive Applications
Low-energy DSP IP optimizes power, performance and area, offering up to 40% area savings for mobile, automotive, consumer and hyperscale computing markets.
18
'21
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HARTING News
Standards for individualists, or: what exactly suits my machines?
One of the most significant challenges in today’s manufacturing technology is the question: How do I serve the "very special and unusual" wishes of end consumers? As things stand today, this would appear to apply only to the end consumer worlds.
18
'21
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Actia News
ACTIA PRESENTS AES.3
AUTOMOTIVE ETHERNET SWITCH 3Smart Ethernet switch for public transport buses.
17
'21
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Teknic News
g-Stop Anti-Vibration Patented Motion Profiles – Available in ClearPath integrated servos!
Teknic’s g-Stop Anti Vibration Motion Profile sculpting is now available in select SC and MC series ClearPath integrated servo motors.
17
'21
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Anritsu News
InterDigital and Anritsu Showcase Smart Factory Use Case for 5G Network Slicing and Multi-Access Edge Computing
Anritsu Corporation is pleased to announce a collaborative demonstration with InterDigital, Inc. (NASDAQ:IDCC), a mobile and video technology research and development company, that showcases a smart factory use case for 5G New Radio (NR) using network slicing and multi-access edge computing (MEC) capabilities.
17
'21
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Keysight technologies News
Keysight’s New Network Benchmarking Solution Enables Mobile Operators to Verify Quality of Experience Across Multiple 4G and 5G Networks
Scalable solution delivers a complete set of measurements via a single drive test.
17
'21
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MURATA News
Silicon capacitor from Murata boosts technology to support the highest performance requirements of new power distribution networks
Murata has extended its product offering for the mobile and high-performance computing (HPC) markets with the availability of its latest silicon process technology to fabricate silicon capacitors with a density of 1.3 µF/mm².
17
'21
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Intel News
Intel Unveils Infrastructure Processing Unit
Intel’s IPU improves data center efficiency and manageability and is the only one built in collaboration with hyperscale cloud partners.
17
'21
Written on
HELLA News
