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CEVA News
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Cadence News
CADENCE ADVANCES RF DESIGN WITH THE LATEST AWR DESIGN ENVIRONMENT PLATFORM
AWR V16 advances heterogeneous technology development for 5G wireless and connected systems for automotive, radar systems and semiconductor technologies. Custom RF to mmWave IP developed with AWR software is now accessible across Cadence design platforms, delivering seamless solutions for wireless systems. Foundational advance in IC, package and PCB RF workflows accelerates design turnaround time to align with customers’ end-market delivery time schedules. Fully integrated FEA solver technologies deliver accurate multiphysics (EM and thermal) systems analysis with near-linear scalability and capacity
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CONTA-CLIP News
Three-level terminals with push-in connection
CONTA-CLIP expands its terminal block range featuring push-in connection for 2.5 mm² cross sections, adding the new PIKD three-level initiator terminals and multi-wire terminals.
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ADCO News
The Chip Shortage: “We’re in it Together.”
ADCO Strengthens Communication and Transparency in Face of Challenges.
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ESCHA News
HIGH SIGNAL DENSITY FOR MINIATURIZED SENSORS
As sensors are becoming more and more complex and compact, the information density to be transmitted is continuously rising. This development directly influences the connectivity to be used and leads to an increasing demand for connectors that are also compact and multipole at the same time. Therefore, the German connectivity specialist ESCHA extends its M8-connector range by multipole variants with 8 pins. A complete product family consisting of molded single-ended- and double-ended cordsets as well as matching receptacles will be on offer right from the market launch. There are two cable qualities to choose from, which particularly meet the demands of automation industry.
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HARTING News
PNO specifies HARTING ix Industrial® as new PROFINET interface
70% smaller Ethernet interface offers miniaturisation potential for PROFINET users.
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Wenglor News
uniVision 2.4 Image Processing Platform: Update Makes 2D/3D Profile Sensors Smart
The latest release of the modular uniVision image processing software has it all: While in the past an external analysis module always had to be used to evaluate 2D/3D profile recordings, the smart 2D/3D profile sensors now combine sensor and analysis module directly in the compact housing thanks to uniVision 2.4.
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Accutronics News
Specialist guide to device battery selection
New whitepaper offers ER battery advice for design engineers and OEMs.
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TDK News
OVERVOLTAGE PROTECTION: TDK OFFERS EXTREMELY SMALL TVS DIODES WITH EXTREMELY LOW CAPACITANCES AND CLAMPING VOLTAGES
TDK Corporation (TSE:6762) has extended its range of TVS (transient voltage suppression) diodes characterized by their extremely low capacitance values for bidirectional overvoltage protection to include the ULC series (Ultra Low Clamping & Capacitance). The SD01005SL-ULC101 (B74111U0033M060) type has a minimum capacitance of ~0.5 pF and the SD0201SL-ULC101 (B74121U0033M060) type of ~0.6 pF, both at 1 MHz.
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Vector News
