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Toshiba News
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KEMET News
KEMET Introduces the Smallest EMI X2 Film Capacitor Solution for Harsh Environments
R53 film capacitor is miniaturized, AEC-Q200 qualified and has the highest IEC robustness classification for applications requiring the highest reliability and extended life under severe, harsh environmental conditions.
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Lattice Semiconductor News
Lattice to Highlight Low Power ML Development with sensAI Solution Stack at ValleyML AI Expo 2021
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the company will deliver a presentation describing how the award-winning Lattice sensAI solution stack can simplify and accelerate development of Edge machine learning applications during the Valley Machine Learning and Artificial Intelligence (ValleyML AI) Expo 2021.
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Carel News
CAREL@HOST: ENERGY EFFICIENCY AND DESIGN EXCELLENCE FOR COMMERCIAL REFRIGERATION
From 22 to 26 October 2021 CAREL will be participating at Host, the biennial catering and hospitality exhibition held in Milan. To celebrate this long-awaited international event, back in person, CAREL will present a new generation of control solutions for professional and commercial refrigeration, combined with an advanced range of connectivity services.
30
'21
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Mouser News
u-blox XPLR-AOA-1 Explorer Kit for Bluetooth Direction Finding Now at Mouser
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, is now stocking the XPLR-AOA-1 Explorer Kit from u-blox.
29
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Sigmatek News
SAFE ANALOG INPUT MODULE: THE SAI 041
The safe analog input module SAI 041 expands the modular S-DIAS Safety System. Four analog current inputs with a measurement range from 4-20 mA and a resolution of 16 bits, as well as the 24 V sensor supply are integrated into the 25 mm wide DIN rail module.
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ST News
STMicroelectronics’ STM32 Ecosystem Extensions Kick-Start Development with STM32U5 Extreme Low-Power Microcontrollers
STMicroelectronics has announced new STM32Cube software packs and tools, as well as evaluation boards, to accelerate development with the latest STM32U5 microcontrollers (MCUs), which are now ready for mass-market applications with stock at authorized distributors.
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TDK News
EMC Components: TDK develops industry’s first high-reliability chip beads for automotive
TDK Corporation (TSE:6762) today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.
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Leica Geosystems News
Hexagon announces Leica ContentMapper – new airborne imaging sensor for efficient large-scale content collection
Hexagon’s Geosystems division announced today the introduction of the Leica ContentMapper, an innovative and highly efficient airborne imaging sensor for large-scale geospatial mapping projects. With a 40,000 pixels swath width, this latest generation camera provides the highest performance for content programs, capturing high resolution imagery at unprecedented rates.
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ST News
