Toshiba Electronic Devices & Storage Corporation ("Toshiba") has begun shipping test samples of "TB9083FTG," a pre-driver IC for automotive applications that include brushless motors for electric power steering systems and electric brakes.
R53 film capacitor is miniaturized, AEC-Q200 qualified and has the highest IEC robustness classification for applications requiring the highest reliability and extended life under severe, harsh environmental conditions.
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the company will deliver a presentation describing how the award-winning Lattice sensAI solution stack can simplify and accelerate development of Edge machine learning applications during the Valley Machine Learning and Artificial Intelligence (ValleyML AI) Expo 2021.
From 22 to 26 October 2021 CAREL will be participating at Host, the biennial catering and hospitality exhibition held in Milan. To celebrate this long-awaited international event, back in person, CAREL will present a new generation of control solutions for professional and commercial refrigeration, combined with an advanced range of connectivity services.
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, is now stocking the XPLR-AOA-1 Explorer Kit from u-blox.
The safe analog input module SAI 041 expands the modular S-DIAS Safety System. Four analog current inputs with a measurement range from 4-20 mA and a resolution of 16 bits, as well as the 24 V sensor supply are integrated into the 25 mm wide DIN rail module.
STMicroelectronics has announced new STM32Cube software packs and tools, as well as evaluation boards, to accelerate development with the latest STM32U5 microcontrollers (MCUs), which are now ready for mass-market applications with stock at authorized distributors.
TDK Corporation (TSE:6762) today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.
Hexagon’s Geosystems division announced today the introduction of the Leica ContentMapper, an innovative and highly efficient airborne imaging sensor for large-scale geospatial mapping projects. With a 40,000 pixels swath width, this latest generation camera provides the highest performance for content programs, capturing high resolution imagery at unprecedented rates.
The VN9D30Q100F and VN9D5D20FN from STMicroelectronics introduce a new generation of automotive intelligent switches, the first in the market with digital current sensing among the fully digital on-chip diagnostic features.