29 {{ "2021-10-29T00:00:00+00:00" | date "MMM" }} '21

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TDK News

INDUCTORS: TDK DEVELOPS INDUSTRY’S HIGHEST RATED CURRENT INDUCTORS FOR AUTOMOTIVE POWER OVER COAX SYSTEMS

TDK Corporation (TSE:6762) announces the release of its newly developed ADL3225VM inductors for use in automotive Power over Coax (PoC) systems. Measuring at 3.2 x 2.5 x 2.5 ㎜ (L x W x H), these inductors provide a compact solution for designers looking to reduce vehicle weight as manufacturers add more sensors and cameras to accommodate expanding automotive and advanced driver-assistance systems (ADAS) applications. The proprietary structural design and wire winding manufacturing process ensure high impedance over a broad bandpass of 1 ㎒ up to 1 ㎓. The inductors are compliant with AEC-Q200 and achieve the highest-rated current in the industry for the 3225 size*. Volume production began in October 2021.

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29 {{ "2021-10-29T00:00:00+00:00" | date "MMM" }} '21

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Pickering News

Pickering Interfaces shows a wide range of test and verification solutions at productronica 2021

New PXI multi-cell battery simulator modules on display. Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, will be demonstrating its latest product developments at productronica 2021, the world’s leading trade fair for electronics development and production, in Munich (November 16th to 19th).

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29 {{ "2021-10-29T00:00:00+00:00" | date "MMM" }} '21

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Melexis News

New version of Melexis Pump/Fan Driver ICs pushes lifetime boundaries to next level

Dedicated automotive pump driver meets requirements for high ambient temperatures and long operating lifetime. In order to address more challenging customer deployments, Melexis has expanded its MLX90412 product offering. The latest version of this 2.2A automotive-qualified pump/fan driver IC is optimized to deal with high ambient temperature levels and supports prolonged operational lifespans.

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29 {{ "2021-10-29T00:00:00+00:00" | date "MMM" }} '21

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ST News

STMicroelectronics’ Automotive-Qualified Navigation Module with Dead Reckoning Simplifies Design and Boosts Performance

To support the positioning market with state-of-the-art GNSS chipset and modules, STMicroelectronics has introduced the Teseo-VIC3DA, the latest member of the Teseo module family.

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29 {{ "2021-10-29T00:00:00+00:00" | date "MMM" }} '21

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Allegro micro News

Allegro Unveils 3-Phase Gate Driver For EV and Hybrid Cars

New device keeps batteries and HVAC systems running quiet and cool. Allegro MicroSystems, a global leader in power and sensing solutions for motion control and energy efficient systems, is expanding its QuietMotion product line with the introduction of the new A89307 automotive-qualified gate driver integrated circuit (IC).

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29 {{ "2021-10-29T00:00:00+00:00" | date "MMM" }} '21

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ANSYS News

Ansys Collaborates with TSMC to Deliver Thermal Analysis Solution for 3D-IC Designs

TSMC collaborated with Ansys using Icepak as thermal reference for the TSMC 3DFabric technologies.

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28 {{ "2021-10-28T00:00:00+00:00" | date "MMM" }} '21

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Impulse Embedded News

UNO-148 Scalable Tiger Lake DIN-Rail Control PC available from Impulse Embedded

Low-power, high-performance 11th Gen Tiger Lake Intel Core processors 2kV isolated I/O and wide input voltage ideal for industrial control applications 2.5GigE LAN supports Intel Time-Sensitive Networking (TSN) for real-time, low latency communications DIN-rail mountable, fanless, and compact.

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28 {{ "2021-10-28T00:00:00+00:00" | date "MMM" }} '21

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Premo News

PREMO enlarges its 3DP-Series (3DPowerTM) of High-Power Integrated Magnetic Components for Power Converters in Automotive (PHEV, HEV, BEV or FCEV). New 3DP-11KWHVHV

This disruptive patented solution has been designed to increase power density (decreasing power magnetic required volume), combining 2 or 3 components in 1 (saving magnetic cores) and reducing weight by 50%. A true cost-effective solution highly demanded by the automotive sector.

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28 {{ "2021-10-28T00:00:00+00:00" | date "MMM" }} '21

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CUI devices News

CUI Devices Introduces Industry’s Smallest Micro Buzzer

CUI Devices’ Audio Group today announced the introduction of a 3.2 mm x 3.2 mm magnetic transducer buzzer, making it among the smallest micro buzzers in the industry.

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28 {{ "2021-10-28T00:00:00+00:00" | date "MMM" }} '21

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HARTING News

Digitalisation of production systems: The right interfaces for late adopters

The fact that digitalisation of production systems is progressing has become an established consensus among manufacturers, operators and service providers in the mechanical engineering sector.

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Market Overview

The 5G RedCap Connects IoT Devices at Lower Cost

Technical Articles

How Solar Radiation Disrupts Electronic Systems and What Solutions Can Protect Them

Case studies

How Siemens’ Solido Software Strengthens Semiconductor’s Competitive Edge in Advanced IC Design

INDUCTORS: TDK DEVELOPS INDUSTRY’S HIGHEST RATED CURRENT INDUCTORS FOR AUTOMOTIVE POWER OVER COAX SYSTEMS

Pickering Interfaces shows a wide range of test and verification solutions at productronica 2021

New version of Melexis Pump/Fan Driver ICs pushes lifetime boundaries to next level

STMicroelectronics’ Automotive-Qualified Navigation Module with Dead Reckoning Simplifies Design and Boosts Performance

To support the positioning market with state-of-the-art GNSS chipset and modules, STMicroelectronics has introduced the Teseo-VIC3DA, the latest member of the Teseo module family.

Allegro Unveils 3-Phase Gate Driver For EV and Hybrid Cars

Ansys Collaborates with TSMC to Deliver Thermal Analysis Solution for 3D-IC Designs

TSMC collaborated with Ansys using Icepak as thermal reference for the TSMC 3DFabric technologies.

UNO-148 Scalable Tiger Lake DIN-Rail Control PC available from Impulse Embedded

Low-power, high-performance 11th Gen Tiger Lake Intel Core processors 2kV isolated I/O and wide input voltage ideal for industrial control applications 2.5GigE LAN supports Intel Time-Sensitive Networking (TSN) for real-time, low latency communications DIN-rail mountable, fanless, and compact.

PREMO enlarges its 3DP-Series (3DPowerTM) of High-Power Integrated Magnetic Components for Power Converters in Automotive (PHEV, HEV, BEV or FCEV). New 3DP-11KWHVHV

This disruptive patented solution has been designed to increase power density (decreasing power magnetic required volume), combining 2 or 3 components in 1 (saving magnetic cores) and reducing weight by 50%. A true cost-effective solution highly demanded by the automotive sector.

CUI Devices Introduces Industry’s Smallest Micro Buzzer

CUI Devices’ Audio Group today announced the introduction of a 3.2 mm x 3.2 mm magnetic transducer buzzer, making it among the smallest micro buzzers in the industry.

Digitalisation of production systems: The right interfaces for late adopters

The fact that digitalisation of production systems is progressing has become an established consensus among manufacturers, operators and service providers in the mechanical engineering sector.

International