Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RX671 group of 32-bit microcontrollers (MCUs), adding a new high-performance, high-functionality single-chip solution with touch sensing and voice recognition capabilities for contactless operation to the popular RX Family.
Omron Electronics Components Europe has announced two new fully sealed, miniature micro switches offering an exceptionally compact and flexible solution for applications exposed to water spray or high levels of dust.
Keyence has introduced a new range of inline telecentric measurement system which employ highly advanced silhouette-based analysis for guaranteed accuracy.
Accelerating technical innovation in the automotive industry to achieve a sustainable society. The global semiconductor manufacturer ROHM, together with Geely Automobile Group Co., Ltd., a leading Chinese automobile manufacturer, have entered into a strategic partnership to develop advanced technologies in the automotive field.
Datalogic, a global leader in the automatic data capture and factory automation markets, is pleased to announce its participation at PACK EXPO 2021 in Las Vegas, with an extensive booth displaying traceability solutions for every application.
Yokohama National University, a national university corporation (Yokohama-city, Kanagawa pref. President: Izuru Umehara, hereinafter “YNU”) and TDK Corporation (Tokyo, President: Shigenao Ishiguro, hereinafter “TDK”) have developed a prototype image diagnosis technology utilizing a high-sensitivity magnetic sensor*.