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TDK News

TDK announces worldwide availability of the InvenSense ICP-10125 waterproof SmartPressure platform

TDK Corporation (TSE: 6762) announces worldwide availability of the InvenSense ICP-10125, part of the SmartPressure family of the MEMS barometric pressure sensor platform. The ICP-10125 achieves the industry’s lowest pressure noise of 0.4 Pa RMS, attains the industry’s lowest power consumption of 1.3 µA, and ensures excellent temperature stability with a temperature coefficient of ±0.5 Pa/°C.

Rohm Semiconductors News

32bit D/A Converter IC for Hi-Fi Audio Equipment

ROHM's first, most advanced MUS-IC series DAC chip enables expressive playback of classical music.

Siemens digital Industry Software News

Siemens delivers next-generation, comprehensive hardware-assisted verification system

Siemens Digital Industries Software unveiled its next-generation Veloce hardware-assisted verification system for the rapid verification of highly sophisticated, next-generation integrated circuit (IC) designs. This is the first complete, integrated offering that combines best-in-class virtual platform, hardware emulation, and Field Programmable Gate Array (FPGA) prototyping technologies and paves the way to leverage the latest powerful hardware-assisted verification methodologies.

PEPPERL+FUCHS FACTORY AUTOMATION

USi®-safety Ultrasonic Sensor System

Pepperl+Fuchs is Expanding its Product Portfolio for Ultrasonic Sensors in the Area of Factory Automation with the Safe USi-safety Ultrasonic Sensor System.

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