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Pilz News

SAFETY LASER SCANNER PSENSCAN FROM PILZ WITH UP TO THREE SEPARATE SAFETY ZONES AND UP TO 70 SWITCHABLE CONFIGURATIONS - MORE FLEXIBLE AND PRODUCTIVE MONITORING OF MOBILE AND STATIONARY APPLICATIONS

Additional digital inputs and outputs are now available for the safety laser scanner PSENscan: Up to 70 switchable configurations can now be implemented and up to three separate safety zones can be monitored simultaneously thanks to the new 17-pin and master encoder types. So stationary areas can be monitored more productively – also using the new partial dynamic muting for example. And new functions for the intralogistics sector – such as encoder evaluation, standby mode and more precise navigation – also provide for more efficient monitoring of mobile applications.

Maxim integrated News

Maxim Integrated's Infrared-Based Dynamic Gesture Sensor Detects a Broader Range of Hand Gestures at Greater Distances, Ensuring Drivers' Eyes Remain on the Road

MAX25405 next-generation optical sensor recognizes a variety of gestures in a quarter of the size and at 10x lower cost than camera-based time-of-flight systems in next-generation automotive, industrial and consumer applications.

CEVA News

CEVA Expands Its Market-Leading Wireless Connectivity Portfolio with New Ultra-Wideband Platform IP

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today unveiled RivieraWaves UWB, an extremely power-efficient ultra-wideband (UWB) turnkey MAC and PHY platform intellectual property (IP) compliant with the IEEE 802.15.4z standard and in accordance with the FiRa consortium specifications.

Cadence News

CADENCE ADVANCES RF DESIGN WITH THE LATEST AWR DESIGN ENVIRONMENT PLATFORM

AWR V16 advances heterogeneous technology development for 5G wireless and connected systems for automotive, radar systems and semiconductor technologies. Custom RF to mmWave IP developed with AWR software is now accessible across Cadence design platforms, delivering seamless solutions for wireless systems. Foundational advance in IC, package and PCB RF workflows accelerates design turnaround time to align with customers’ end-market delivery time schedules. Fully integrated FEA solver technologies deliver accurate multiphysics (EM and thermal) systems analysis with near-linear scalability and capacity

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