10 {{ "2021-09-10T00:00:00+00:00" | date "MMM" }} '21

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REO News

Power quality specialist simplifies product specification

REO alters its offering of industry-specific power solutions.

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09 {{ "2021-09-09T00:00:00+00:00" | date "MMM" }} '21

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Silicon Labs News

Silicon Labs host industry leaders for panel on the global semiconductor shortage at IoT 'Works With' conference

Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced a Works With 2021 panel discussing the global semiconductor shortage featuring panelists from the Global Semiconductor Alliance (GSA), Advanced Semiconductor Engineering (ASE, Inc.), Arrow Electronics and Silicon Labs.

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09 {{ "2021-09-09T00:00:00+00:00" | date "MMM" }} '21

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XILINX News

Xilinx Showcases New Solutions and Technologies for Software and Hardware Developers as Xilinx Adapt 2021 Kicks Off

Week one unveils software developer kit for intelligent video analytics applications, an expanded video and imaging IP portfolio and developer design contest.

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09 {{ "2021-09-09T00:00:00+00:00" | date "MMM" }} '21

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Toshiba News

TOSHIBA EXPAND THE TXZ+TM FAMILY WITH ARM^® CORTEX^®-M4 MICROCONTROLLERS FOR HIGH-SPEED DATA PROCESSING

Toshiba Electronics Europe GmbH (“Toshiba”) announces the availability of 20 new microcontroller devices for high-speed data processing of the TXZ+TM family advanced class. These M4G group products are now part of the TXZ+ family advanced class and are manufactured in a 40nm process.

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09 {{ "2021-09-09T00:00:00+00:00" | date "MMM" }} '21

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Intel News

MOBILEYE AND SIXT PLAN NEW ROBOTAXI SERVICE

At IAA Mobility, Intel CEO Pat Gelsinger and Sixt SE Co-CEO Alexander Sixt announced a collaboration to begin offering a driverless robotaxi service in Munich starting next year. Riders can hail one of the robotaxis using either the Moovit app or the integrated SIXT app for ride hailing, vehicle rental, car sharing and car subscriptions.

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09 {{ "2021-09-09T00:00:00+00:00" | date "MMM" }} '21

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TE Connectivity News

TE Connectivity’s Mezalok connector delivers high speed with low force

The HSLF XMC connector delivers 32+ Gb/s with a lower extraction force.

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09 {{ "2021-09-09T00:00:00+00:00" | date "MMM" }} '21

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Anritsu News

Anritsu announces 5G Standalone Network Service Assurance in the Public Cloud on AWS

Anritsu is pleased to announce the deployment of its Mobile Network Service Assurance solutions on the public cloud with AWS.

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09 {{ "2021-09-09T00:00:00+00:00" | date "MMM" }} '21

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Congatec News

Real-time Ethernet with open standards

congatec presents edge computing platforms with TSN support for real-time factories.

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09 {{ "2021-09-09T00:00:00+00:00" | date "MMM" }} '21

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Digi-key News

Digi-Key Electronics Announces 2021 Back2School Prize Draw

Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, will hold their highly anticipated annual Back2School Prize Draw sweepstakes, which gives college students an opportunity to win prizes while using real-world tools and resources to learn about the field of engineering.

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09 {{ "2021-09-09T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-09-09T00:00:00+00:00" | date "longDate" }}

PANASONIC ELECTRIC WORKS News

High data rates, low-power operation: New dual-band Wi-Fi 5 and Bluetooth^® 5 module PAN9028 guarantees maximum flexible connectivity

Following the market’s high demand for modules suiting highly integrated applications and rapid certification processes, Panasonic Industry now presents the PAN9028 Wi-Fi^® radio module with integrated Bluetooth^® wireless functionality.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

Power quality specialist simplifies product specification

REO alters its offering of industry-specific power solutions.

Silicon Labs host industry leaders for panel on the global semiconductor shortage at IoT 'Works With' conference

Xilinx Showcases New Solutions and Technologies for Software and Hardware Developers as Xilinx Adapt 2021 Kicks Off

Week one unveils software developer kit for intelligent video analytics applications, an expanded video and imaging IP portfolio and developer design contest.

TOSHIBA EXPAND THE TXZ+TM FAMILY WITH ARM^® CORTEX^®-M4 MICROCONTROLLERS FOR HIGH-SPEED DATA PROCESSING

Toshiba Electronics Europe GmbH (“Toshiba”) announces the availability of 20 new microcontroller devices for high-speed data processing of the TXZ+TM family advanced class. These M4G group products are now part of the TXZ+ family advanced class and are manufactured in a 40nm process.

MOBILEYE AND SIXT PLAN NEW ROBOTAXI SERVICE

TE Connectivity’s Mezalok connector delivers high speed with low force

The HSLF XMC connector delivers 32+ Gb/s with a lower extraction force.

Anritsu announces 5G Standalone Network Service Assurance in the Public Cloud on AWS

Anritsu is pleased to announce the deployment of its Mobile Network Service Assurance solutions on the public cloud with AWS.

Real-time Ethernet with open standards

congatec presents edge computing platforms with TSN support for real-time factories.

Digi-Key Electronics Announces 2021 Back2School Prize Draw

High data rates, low-power operation: New dual-band Wi-Fi 5 and Bluetooth^® 5 module PAN9028 guarantees maximum flexible connectivity

Following the market’s high demand for modules suiting highly integrated applications and rapid certification processes, Panasonic Industry now presents the PAN9028 Wi-Fi^® radio module with integrated Bluetooth^® wireless functionality.

International

Market Overview

Technical Articles

Case studies

REO alters its offering of industry-specific power solutions.

Week one unveils software developer kit for intelligent video analytics applications, an expanded video and imaging IP portfolio and developer design contest.

Toshiba Electronics Europe GmbH (“Toshiba”) announces the availability of 20 new microcontroller devices for high-speed data processing of the TXZ+TM family advanced class. These M4G group products are now part of the TXZ+ family advanced class and are manufactured in a 40nm process.

The HSLF XMC connector delivers 32+ Gb/s with a lower extraction force.

Anritsu is pleased to announce the deployment of its Mobile Network Service Assurance solutions on the public cloud with AWS.

congatec presents edge computing platforms with TSN support for real-time factories.

Following the market’s high demand for modules suiting highly integrated applications and rapid certification processes, Panasonic Industry now presents the PAN9028 Wi-Fi® radio module with integrated Bluetooth® wireless functionality.

International

Following the market’s high demand for modules suiting highly integrated applications and rapid certification processes, Panasonic Industry now presents the PAN9028 Wi-Fi^® radio module with integrated Bluetooth^® wireless functionality.