08
'21
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NEC Corporation News
08
'21
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Autodesk News
Autodesk Confirms Proposal to Acquire Electronic Design Software Leader Altium Limited
Autodesk, Inc. (NASDAQ: ADSK) today confirmed that it has submitted a non-binding proposal to acquire all the outstanding shares of common stock of Altium Limited (ASX: ALU) for AUD$38.50, to be implemented by way of a scheme of arrangement.
08
'21
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IDS Imaging Development Systems GmbH
Free 3-in-1 online event on the IDS Vision Channel on June 24th at 2 p.m
Focus event "Capture the Light" with image processing experts from IDS
07
'21
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ONSEMI News
ON Semiconductor Announces New Full Silicon Carbide MOSFET Module Solutions for Charging Electric Vehicles at APEC 2021
Comprehensive portfolio of wide bandgap devices for high-performance charging solutions.
07
'21
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Fraunhofer News
Terahertz technologies for visionary innovations in communications and sensor technology
n the recently launched joint project "T-KOS" of the Research Fab Microelectronics Germany (FMD), terahertz technology is now to be developed synergistically for industry in the fields of communication and sensor technology for the first time.
07
'21
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Sivers Semiconductors News
Sivers Semiconductors signs new reseller agreement for millimeter wave business in Japan
Sivers Semiconductors AB today announced that its subsidiary, Sivers Wireless, has signed a reseller agreement with Japanese electronics specialist Shoshin.
07
'21
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TTI News
TTI receives European Distribution Award from Abracon
TTI, Inc., a specialist distributor of electronic components, has been presented with another major accolade.
07
'21
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Prysmian Group News
Prysmian Group protecting fibre networks and transmitted signals from hackers
Latest Industry Insight highlights the need for operators to leverage bend resistant solutions in order to fully secure network end-to-end.
07
'21
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Intel News
Reinventing Chip Design from the Outside In
In the first ‘Behind the Builders,’ Intel Fellow Johanna Swan explains how chip packaging went from a basic utility to ‘a real inflection point, maximizing performance per volume.’
07
'21
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TE Connectivity News
